Subject: General Tech | August 18, 2011 - 10:43 AM | Jeremy Hellstrom
Tagged: shortage, llano, amd
Not all is well with AMD and GLOBALFOUNDRIES 32nm process as the yields have been so low as to effect the supply of Llano chips. Currently only two chips, the A8-3850 and A6-3650 are on the market, with three more models expected fairly soon. Since AMD beleives that there supply difficulties will be overcome by September the shortages should not delay the release of the new lower power chips. DigiTimes also mentioned some news about NVIDIA's 28nm products that makes the outlook for this time next year a little bleak.
"AMD's latest Llano-based processors are currently suffering from shortages due to the weaker-than-expected yield rates of the related 32nm process; however, AMD has already notified its partners that the shortage should be resolved by early September, according to sources from motherboard makers.
Due to the new platform's strong performance/price ratio, market demand for Llano APUs is rising gradually with sales of the compatible A75-based motherboards also expected to increase, the sources noted. However, because the supply of Llano APUs in July started turn tight because of weak 32nm yields, AMD currently has a lot of orders from the retail channel, but is unable to fulfill the shipments.
With AMD set to resolve its APU shortages in early September, many motherboard makers are already starting to increase their A75-based motherboard shipments.
In addition to the existing Llano CPUs, A8-3850 and A6-3650, AMD will launch three more 65W APUs, A8-3800, A6-3600 and A6-3500 at the end of the third quarter.
In additional news, although AMD, Nvidia and Qualcomm's 28nm chips finished tape-outs in June, and the companies are all ready to place orders in the second half, as demand from the retail channel remains weak, it is likely that the players will delay their orders to a later time, the sources added."
Here is some more Tech News from around the web:
- Researchers speed up organic semiconductors @ SemiAccurate
- AMD sweetens A-series APU launch with an SDK @ The Inquirer
- Linux 'is no longer the challenger', says Red Hat CEO @ The Inquirer
- Kodak EasyShare Max Z990 Review @ TechReviewSource
- Win a Toshiba Satellite C660-125 Intel 320GB 15.6 Inch Laptop @ Tech-Reviews
Subject: Graphics Cards | August 17, 2011 - 03:14 PM | Jeremy Hellstrom
Tagged: graphics drivers, catalyst, amd
- Improves performance up to 10% in Crysis 2 DirectX 11 version for both non-Anti-Aliasing, and application enabled Anti-Aliasing cases on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series
- Improves performance up to 8% in Fear 3 DirectX 11 version with application enabled Anti-Aliasing on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series
- Improves performance up to 30% when AMD’s Morphological Anti-Aliasing (MLAA) is enabled through the Catalyst™ Control Center on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series
- Improves performance up to 20% in Call of Duty Black Operations for single GPU and Multi-GPU configurations on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series
For more information on AMD Catalyst™ 11.8 (for Windows 7, Windows Vista, Windows XP), including all of the resolved issues and performance highlights in this release, please see the AMD Catalyst™ 11.8 release notes.
Subject: Processors | August 17, 2011 - 12:03 PM | Tim Verry
Tagged: APU, amd radeon, amd, A6-3500
AMD announced today a new desktop APU (Accelerated Processing Unit). The A6-3500 processor combines three x86 CPU cores with 320 Radeon GPU cores. The new A6-3500 APU comes with a full sweep of AMD technology, including Turbo Core, Steady Video image stabilization technology, DDR3 1333 support, HDCP compatibility, and AMD VISION Engine software. Following its predecessors, the new three core APU is able to pair with select AMD Radeon HD 6000 series discrete graphics cards.
This FM1 socket awaits an A Series APU like the new A6-3500
The three core APU operates at 2.1GHz (2.4GHz with Turbo Boost active) on the CPU side and 444MHz on the GPU side of things. Further, the APU features 3MB of L2 cache, a TDP of 65 watts, and is designed for use with FM1 motherboards.
The APU is now available for purchase at various online retailers and system builders with an MSRP of $95 USD. AMD states that the processor “delivers a compelling, affordable desktop experience for consumers and gamers.”
At under a $100, the new APU is an attractive option for HTPC usage and starter gaming systems on a tight budget. For more information on AMD’s APU architecture, can check out PC Perspective’s AMD A8-3850 APU review here.
Subject: Cases and Cooling, Processors | August 13, 2011 - 02:53 AM | Tim Verry
Tagged: amd, FX, octocore, water cooling, sealed loop, LCS, hsf
According to Xbit Labs, AMD is considering switching out the usual air cooler (HSF) for a sealed loop liquid cooling solution (LCS) for its high end FX Processors. Specifically, AMD wants to pair their highest end eight core processor (and possibly the next highest end eight core chip) with the sealed loop liquid cooling solution. This information, they believe, comes from a “source with knowledge of the company’s plans.”
If you are not familiar with the sealed loop water coolers, PC Perspective reviewed the Corsair H70 processor cooler last year and it is a good example. Sealed loop water coolers are similar to the large DIY water cooling loops comprised of a large radiator, copper CPU block, pump, and reservoir all connected in a loop by tubing; however, they usually have smaller radiators and pumps as well as coolant that cannot be refilled (and should not have to be). This coolant carries heat away from the processor to be dissipated through a radiator. Corsair in particular has heavily invested in this once very niche product with it’s H series of coolers.
Traditionally, both Intel and AMD have been content in pairing their chips with mid-range but cheap air coolers that did a decent job of keeping the processors within their thermal limits at stock speeds. Enthusiasts, and especially those interested in overclocking, have generally ditched the included cooler in favor of a more powerful and/or quieter aftermarket cooler. Needless to say, including a cooler, especially with high end chips that will likely go to enthusiasts, that’s never even used only serves to add additional unnecessary cost for both consumers and the manufacturer. Thus, this move to bundle a more powerful sealed loop water cooler with its high end chips may be an attempt by AMD to futher appeal to enthusiasts and keep with their traditional image of being friendly to overclockers and hardware enthusiasts. Having and using a water cooler that is supported by the chip maker certainly doesn’t hurt, especially if it ever came down to warranty and RMA situations. On the other hand, enthusiasts can be very picky about which cooler to use in their systems; therefore, bundling a cooler that is sure to add even more extra cost to the package may not be the right move for AMD. At best, consumers are likely to see an extra $50 or so added to the sure to be pricey highest end eight core chips.
Their idea, if true, surely has merit, but is it wise? Let us know your thoughts in the comments below!
Last week we were in Dallas, Texas covering Quakecon 2011 as well as hosting our very own PC Perspective Hardware Workshop. While we had over 1100 attendees at the event and had a blast judging the case mod contest, one of the highlights of the event is always getting to sit down with John Carmack and pick his brain about topics of interest. We got about 30 minutes of John's time over the weekend and pestered him with questions about the GPU hardware race, how Intel's intergrated graphics (and AMD Fusion) fit in the future of PCs, the continuing debate about ray tracing, rasterization, voxels and infinite detail engines, key technologies for PC gamers like multi-display engines and a lot more!
One of our most read articles of all time was our previous interview with Carmack that focused a lot more on the ray tracing and rasterization debate. If you never read that, much of it is still very relevant today and is worth reading over.
This year though John has come full circle on several things including ray tracing, GPGPU workloads and even the advantages that console hardware has over PC gaming hardware.
Subject: General Tech | August 11, 2011 - 02:27 PM | Ken Addison
Tagged: podcast, pcper, nvidia, msi, Intel, GTX580, amd
PC Perspective Podcast #165 - 8/11/2011
This week we talk about QuakeCon 2011, MSI's GTX580 Lightning, Intel 710 SSDs, Ultrabooks and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the iTunes Store
- RSS - Subscribe through your regular
- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath and Allyn Malventano
This Podcast is brought to you by
- 0:00:27 Introduction
- 1-888-38-PCPER or email@example.com
- http://twitter.com/ryanshrout and http://twitter.com/pcper
- 0:02:02 Quakecon 2011 and our Workshop - Postmortem
- 0:18:05 This Podcast is brought to you by
, and their all new Sandy Bridge Motherboards!
- 0:18:54 MSI N580GTX Lightning Xtreme Edition Review: What a GTX 580 Should Be
- 0:30:18 Antec High Current Gamer HCG-750 PSU Review
- 0:31:30 Samsung Galaxy Tab 10.1 Review - The Best Android Tablet?
- 0:32:16 Just Delivered Exclusive: PNY XLR8 Liquid Cooled GTX 580 Combo
- 0:36:40 Let us do some math, shall we? The cost of consoles
- 0:41:46 Intel 710 SSD Prices Leaked
- 0:47:40 ExpressCard trying to pull a (not so) fast one?
- 0:55:30 NVIDIA Outlines Multi-GPU and Cloud Graphics With Project Maximus and Virtual Graphics Technologies
- 1:06:50 Will Intel's Ultrabook form factor come with an integral Achilles Heel?
- 1:09:15 Hardware / Software Pick of the Week
- 1-888-38-PCPER or firstname.lastname@example.org
- http://twitter.com/ryanshrout and http://twitter.com/pcper
- 1:23:50 Closing
Subject: Motherboards | August 9, 2011 - 06:42 PM | Tim Verry
Tagged: motherboard, ECS, APU, amd, A55
According to Tech Connect, ECS is about to release three ECS FM1 motherboards powered by the lighter A55 chipset to compliment the company’s higher end A75 boards. The new A55 based motherboards will be known as the A55F-A, A55F-M2, and the A55F-M3, the first being ATX and the remaining two boards being micro-ATX.
The new motherboards will support AMD’s A Series APUs and will feature one PCI-E x16 slot, Gigabit Ethernet, and one VGA connection. The standard ATX sized A55F-A will further have four DDR3 DIMM slots, five SATA II 3Gb/s ports, 12 USB 2.0 ports, and HDMI and DVI video connectors. The A55F-M2 on the other hand with receive two DDR3 DIMM slots, six SATA 3Gb/s ports, 12 USB 2.0 ports, and HDMI and optional DVI connections. Lastly, the A55F-M3 has two DDR3 DIMM slots, four SATA 3Gb/s ports, and eight USB 2.0 ports.
More photos of the new boards can be seen here. Price and availability of the new A55 chipset motherboards have not yet been released.
Subject: General Tech | August 9, 2011 - 03:30 PM | Jeremy Hellstrom
Tagged: amd, tablet, smartphones, trinity
In a revent interview, AMD's SVP and GM, Rick Bergman restated that AMD has no current plans in the works to jump to the handheld market. They will continue to focus on their current product lines and that the only ultramobile development currently underway is for tablets. That could help them get a leg up on Intel's Atom, as Intel is definitely making a move for the hand held market. Focusing on tablets gives them a less strict power limitation and may just give them a boost as they push to the 28nm process with only one ultra low power Trinity APU product line to design. Check out The Inquirer for more.
"CHIP DESIGNER AMD has ruled out making a move in the smartphone market, preferring to concentrate on tablets.
Rick Bergman, SVP and GM of AMD's products group told a conference that the chip designer has no plans to get into the smartphone market, saying that its expertise in graphics does not suit that market. Instead it will be up to AMD's Z-series embedded chip to push X86 into the tablet market."
Here is some more Tech News from around the web:
- Beware of Macs in enterprise, security consultants say @ The Register
- Mass WordPress hijack poisons Google Image well @ The Register
- Sale of Samsung Galaxy Tab Blocked in the EU @ Slashdot
- 10-year old hacker finds flaw in mobile games @ The Register
- Magellan RoadMate 5175T-LM Review @ TechReviewSource
- Jabra Freeway Bluetooth Car Kit Review @ t-break
- Real World Labs And Thermalright Joint Contest
Subject: Graphics Cards, Processors | August 8, 2011 - 08:28 PM | Tim Verry
Tagged: amd, APU, sdk, opencl
AMD released its new APUs (Accelerated Processing Unit) to the masses, and now they are revving the processors up with a new software development kit that increases performance and efficiency of OpenCL based applications. The new version 2.5 APP SDK is tailored to the APU architecture where the CPU and GPU are on the same die. Building on the OpenCL standard, APP SDK 2.5 promises to reduce the bandwidth limitation of the CPU to GPU connection, allowing for effective data transfer rates as high as 15GB per second in AMDs A Series APUs. Further performance enhancements include reduced kernel launch times and PCIe overhead.
AMD states that the new APP SDK will improve multi-gpu support for AMD APU graphics paired with a discrete card, and will “enable advanced capabilities” to improve the user experience including gesture based interfaces, image stabilization, and 3D applications.
The new development kit is currently being used by developers worldwide in the AMD OpenCl coding competition, where up to $50,000 in prizes will be given away to winning software submissions. You can get started with the SDK here.
When building a computer, enthusiasts are likely to combine components from several different manufacturers, especially on the Intel side. Short of the power supply, hard drive, and accessories; however, AMD is slowing diversifying to provide components to put together an all-AMD system. Before today, AMD already had the motherboard, processor, and graphics card (including processor graphics if that's your thing), and today Maximum PC reports that AMD may be moving into the RAM market with its own line of Radeon branded memory. It seems that AMD's future Leo-like platform may resemble a small AMD branded borg cube.
The new memory in question is comprised of 2GB, DDR3 sticks and comes in three series branded the "Entertainment," "ULTRA PRO Gaming," and "Enterprise." The enthusiastic naming conventions aside, the Entertainment series looks to be the budget modules for those looking for stable DIMMs that get the job done for cheap. They have a rated speed of 1333Mbps and a CAS latency of 9-9-9. The next highest series is the "ULTRA PRO Gaming" series, which promises to be overclocking friendly. These DIMMs receive a slight boost in speed to 1600Mbps while taking a slight dip in CAS latency to 11-11-11. The final, and likely most expensive, modules are the Enterprise series. These modules are still somewhat of a mystery as the specifications have yet to be announced by AMD; however, they are likely geared more towards enterprise workstations than servers as they are unbuffered DIMMs.
Further, all three series are rated to run at 1.5V and have a height of 30mm. Unfortunately, there is no word yet on price or availability. There are; however, several photos of Radeon branded memory modules over at PC Watch for you to check out. Do you think AMD's move to enter the DRAM market is a good thing or a bad thing for future profitability?
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