Some familiar scenery
If you thought that Intel was going to slow down on its iteration in the SFF (small form factor) system design, you were sadly mistaken. It was February when Intel first sent us a NUC based on Broadwell, an iterative upgrade over a couple of generations for this very small platform, 4" x 4", that showed proved to be interesting from a technology stand point but didn't shift expectations of the puck-sized PC business.
Today we are looking at yet another NUC, also using a Broadwell processor, though this time the CPU is running quite a bit faster, with Intel Iris 6100 graphics and a noticeably higher TDP. The Core i7-5557U is still a dual-core / HyperThreaded processor but it increases base and Turbo clocks by wide margins, offering as much as 35% better CPU performance and mainstream gaming performance boosts in the same range. This doesn't mean the NUC 5i7RYH will overtake your custom built desktop but it does make it a lot more palatable for everyday PC users.
Oh, and we have an NVMe PCI Express SSD inside this beast as well. (Waaaaaa??)
Subject: Mobile | March 1, 2015 - 02:01 PM | Sebastian Peak
Tagged: SoC, smartphones, Samsung, MWC 2015, MWC, Galaxy S6 Edge, galaxy s6, Exynos 7420, 14nm
Samsung has announced the new Galaxy S phones at MWC, and the new S6 and S6 Edge should be in line with what you were expecting if you’ve followed recent rumors.
The new Samsung Galaxy S6 and S6 Edge (Image credit: Android Central)
As expected we no longer see a Qualcomm SoC powering the new phones, and as the rumors had indicated Samsung opted instead for their own Exynos 7 Octa mobile AP. The Exynos SoC’s have previously been in international versions of Samsung’s mobile devices, but they have apparently ramped up production to meet the demands of the US market as well. There is an interesting twist here, however.
The Exynos 7420 powering both the Galaxy S6 and S6 Edge is an 8-core SoC with ARM’s big.LITTLE design, combining four ARM Cortex-A57 cores and four Cortex-A53 cores. Having announced 14nm FinFET mobile AP production earlier in February the possibility of the S6 launching with this new part was interesting, as the current process tech is 20nm HKMG for the Exynos 7. However a switch to this new process so soon before the official announcement seemed unlikely as large-scale 14nm FinFET production was just unveiled on February 16. Regardless, AnandTech is reporting that the new part will indeed be produced using this new 14nm process technology, and this gives Samsung an industry-first for a mobile SoC with the launch of the S6/S6 Edge.
GSM Arena has specs of the Galaxy S6 posted, and here’s a brief overview:
- Display: 5.1” Super AMOLED, QHD resolution (1440 x 2560, ~577 ppi), Gorilla Glass 4
- OS: Android OS, v5.0 (Lollipop) - TouchWiz UI
- Chipset: Exynos 7420
- CPU: Quad-core 1.5 GHz Cortex-A53 & Quad-core 2.1 GHz Cortex-A57
- GPU: Mali-T760
- Storage/RAM: 32/64/128 GB, 3 GB RAM
- Camera: (Primary) 16 MP, 3456 x 4608, optical image stabilization, autofocus, LED flash
- Battery: 2550 mAh (non-removable)
The new phones both feature attractive styling with metal and glass construction and Gorilla Glass 4 sandwiching the frame, giving each phone a glass back.
The back of the new Galaxy S6 (Image credit: Android Central)
The guys at Android Central (source) had some pre-release time with the phones and have a full preview and hands-on video up on their site. The new phones will be released worldwide on April 10, and no specifics on pricing have been announced.
Core M 5Y70 Specifications
Back in August of this year, Intel invited me out to Portland, Oregon to talk about the future of processors and process technology. Broadwell is the first microarchitecture to ship on Intel's newest 14nm process technology and the performance and power implications of it are as impressive as they are complex. We finally have the first retail product based on Broadwell-Y in our hands and I am eager to see how this combination of technology is going to be implemented.
If you have not read through my article that dives into the intricacies of the 14nm process and the architectural changes coming with Broadwell, then I would highly recommend that you do so before diving any further into this review. Our Intel Core M Processor: Broadwell Architecture and 14nm Process Reveal story clearly explains the "how" and "why" for many of the decisions that determined the direction the Core M 5Y70 heads in.
As I stated at the time:
"The information provided by Intel about Broadwell-Y today shows me the company is clearly innovating and iterating on its plans set in place years ago with the focus on power efficiency. Broadwell and the 14nm process technology will likely be another substantial leap between Intel and AMD in the x86 tablet space and should make an impact on other tablet markets (like Android) as long as pricing can remain competitive. That 14nm process gives Intel an advantage that no one else in the industry can claim and unless Intel begins fabricating processors for the competition (not completely out of the question), that will remain a house advantage."
With a background on Intel's goals with Broadwell-Y, let's look at the first true implementation.
Subject: Editorial | October 15, 2014 - 12:39 PM | Josh Walrath
Tagged: revenue, Results, quarterly, Q3, Intel, haswell, Broadwell, arm, amd, 22nm, 2014, 14nm
Yesterday Intel released their latest quarterly numbers, and they were pretty spectacular. Some serious milestones were reached last quarter, much to the dismay of Intel’s competitors. Not everything is good with the results, but the overall quarter was a record one for Intel. The company reported revenues of $14.55 billion dollars with a net income of $3.31 billion. This is the highest revenue for a quarter in the history of Intel. This also is the first quarter in which Intel has shipped 100 million processors.
The death of the PC has obviously been overstated as the PC group had revenue of around $9 billion. The Data Center group also had a very strong quarter with revenues in the $3.7 billion range. These two groups lean heavily on Intel’s 22 nm TriGate process, which is still industry leading. The latest Haswell based processors are around 10% of shipping units so far. The ramp up for these products has been pretty impressive. Intel’s newest group, the Internet of Things, has revenues that shrank by around 2% quarter over quarter, but it has grown by around 14% year over year.
Not all news is good news though. Intel is trying desperately to get into the tablet and handheld markets, and so far has had little traction. The group reported revenues in the $1 million range. Unfortunately, that $1 million is offset by about $1 billion in losses. This year has seen an overall loss for mobile in the $3 billion range. While Intel arguably has the best and most efficient process for mobile processors, it is having a hard time breaking into this ARM dominated area. There are many factors involved here. First off there are more than a handful of strong competitors working directly against Intel to keep them out of the market. Secondly x86 processors do not have the software library or support that ARM has in this very dynamic and fast growing section. We also must consider that while Intel has the best overall process, x86 processors are really only now achieving parity in power/performance ratios. Intel still is considered a newcomer in this market with their 3D graphics support.
Intel is quite happy to take this loss as long as they can achieve some kind of foothold in this market. Mobile is the future, and while there will always be the need for a PC (who does heavy duty photo editing, video editing, and immersive gaming on a mobile platform?) the mobile market will be driving revenues from here on out. Intel absolutely needs to have a presence here if they wish to be a leader at driving technologies in this very important market. Intel is essentially giving away their chips to get into phones and tablets, and eventually this will pave the way towards a greater adoption. There are still hurdles involved, especially on the software side, but Intel is working hard with developers and Google to make sure support is there. Intel is likely bracing themselves for a new generation of 20 nm and 16 nm FinFET ARM based products that will start showing up in the next nine months. The past several years has seen Intel push mobile up to high priority in terms of process technology. Previously these low power, low cost parts were relegated to an N+1 process technology from Intel, but with the strong competition from ARM licensees and pure-play foundries Intel can no longer afford that. We will likely see 14 nm mobile parts from Intel sooner as opposed to later.
Intel has certainly shored up a lot of their weaknesses over the past few years. Their integrated 3D/GPU support has improved in leaps and bounds over the years, their IPC and power consumption with CPUs is certainly industry leading, and they continue to pound out impressive quarterly reports. Intel is certainly firing on all cylinders at this time and the rest of the industry is struggling to keep up. It will be interesting to see if Intel will keep up with this pace, and it will be imperative for the company to continue to push into mobile markets. I have never counted Intel out as they have a strong workforce, a solid engineering culture, and some really amazingly smart people (except Francois… he is just slightly above average- he is a GT-R aficionado after all).
Next quarter appears to be more of the same. Intel is expecting revenue in the $14.7 billion, plus or minus $500 million. This continues along with the strong sales of PC and server parts for Intel that helps buoy them to these impressive results. Net income and margins again look to appear similar to what this past quarter brought to the table. We will see the introduction of the latest 14 nm Broadwell processors, which is an important step for Intel. 14 nm development and production has taken longer than people expected, and Intel has had to lean on their very mature 22 nm process longer than they wanted to. This has allowed a few extra quarters for the pure-play foundries to try to catch up. Samsung, TSMC, and GLOBALFOUNDRIES are all producing 20 nm products with a fast transition to 16/14 nm FinFET by early next year. This is not to say that these 16/14nm FinFET products will be on par with Intel’s 14 nm process, but it at least gets them closer. In the near term though, these changes will have very little effect on Intel and their product offerings over the next nine months.
Subject: Shows and Expos | September 9, 2014 - 05:27 PM | Ryan Shrout
Tagged: Skylake, Intel, idf 2014, idf, 14nm
2015 is shaping up to be an interesting year for Intel's consumer processor product lines. We are still expected to see Broadwell make some kind of debut in a socketed form in addition to the mobile releases trickling out beginning this holiday, but it looks like we will also get our first taste of Skylake late next year.
Skylake is Intel's next microarchitecture and will be built on the same 14nm process technology currently shipping with Broadwell-Y. Intel stated that it expects to see dramatic improvements in all areas of measurement including performance, power consumption and silicon efficiency.
On stage the company demoed Skylake running the 3DMark Fire Strike benchmark though without providing any kind of performance result (obviously). That graphics demo was running on an engineering development board and platform and though it looked incredibly good from where we were sitting, we can't make any guess as to the performance quite yet.
Intel then surprised us by bringing a notebook out from behind the monitor showing Skylake up and running in a mobile form factor decoding and playing back 4K video. Once again, the demo was smooth and impressive though you expect no more from an overly rehearsed keynote.
Intel concluded that it was "excited about the health of Skylake" and that they should be in mass production in the first quarter of 2015 with samples going out to customers. Looking even further down the rabbit hole the company believes they have a "great line of sight to 10nm and beyond."
Even though details were sparse, it is good news for Intel that they would be willing to show Skylake so early and yet I can't help but worry about a potentially shorter-than-expected life span for Broadwell in the desktop space. Mobile users will find the increased emphasis on power efficiency a big win for thin and light notebooks but enthusiast are still on the look out for a new product to really drive performance up in the mainstream.
Subject: General Tech, Systems, Mobile | September 9, 2014 - 01:49 AM | Scott Michaud
Tagged: Intel, asus, core m, broadwell-y, Broadwell, 14nm, ultrabook
This will probably be the first of many notebooks announced that are based on Core M. These processors, which would otherwise be called Broadwell-Y, are the "flagship" CPUs to be created on Intel's 14nm, tri-gate fabrication process. The ASUS ZenBook UX305 is a 13-inch clamshell notebook with one of three displays: 1920x1200 IPS, 1920x1200 multi-touch IPS, or 3200x1800 multi-touch IPS. That is a lot of pixels to pack into such a small display.
While the specific processor(s) are not listed, it will use Intel HD Graphics 5300 for its GPU. This is new with Broadwell, albeit their lowest tier. Then again, last generation's 5000 and 5100 were up in the 700-800 GFLOP range, which is fairly high (around medium quality settings for Battlefield 4 at 720p). Discrete graphics will not be an option. It will come with a choice between 4GB and 8GB of RAM. Customers can also choose between a 128GB SSD, or a 256GB SSD. It has a 45Wh battery.
Numerous connectivity options are available: 802.11 a, g, n, or ac; Bluetooth 4.0; three USB 3.0 ports; Micro HDMI (out); a 3.5mm headphone/mic combo jack; and a microSD card slot. It has a single, front-facing, 720p webcam.
In short, it is an Ultrabook. Pricing and availability are currently unannounced.
Subject: Processors | September 5, 2014 - 12:11 PM | Ryan Shrout
Tagged: Intel, core m, broadwell-y, Broadwell, 14nm
In a somewhat surprising fashion, Intel has decided to announce (again) the Core M processor family that will be shipping this fall and winter using the Broadwell-Y SoC. I was able to visit Portland and talk with the process technology and architecture teams back in early August so much of the news coming out today about the improvements of 14nm tri-gate transistors, the smaller package size of Broadwell-Y and the goals for thinner, fanless designs is going to be a repeat for frequent PC Perspective readers. (You can see that original story, Intel Core M Processor: Broadwell Architecture and 14nm Process Reveal.)
What is new information today are specifics on the clock speeds and SKU offerings.
|Base Freq||1.10 GHz||800 MHz||800 MHz|
|Max Single Core Turbo||2.6 GHz||2.0 GHz||2.0 GHz|
|Max Dual Core Turbo||2.6 GHz||2.0 GHz||2.0 GHz|
|Max Quad Core Turbo||N/A||N/A||N/A|
|Graphics||Intel HD Graphics 5300||Intel HD Graphics 5300||Intel HD Graphics 5300|
|Graphics Base/Max Freq||100/850 MHz||100/800 MHz||100/800 MHz|
|LPDDR3L Memory Speed||1600 MHz||1600 MHz||1600 MHz|
|TDP||4.5 watts||4.5 watts||4.5 watts|
Intel has planned three options, all with the same $281 pricing, though obviously based on volume and other deals with OEMs, these are likely to shift. The Core M 5Y70 is the highest performance part with a base clock speed of 1.10 GHz that can scale up to 2.6 GHz with one or both cores active. The other two parts launching today both feature 800 MHz base clocks and 2.0 GHz maximum Turbo speeds.
With that scaling information, and the wide range that the Intel HD Graphics 5300 can hit (100-800 MHz) Intel is doubling down on the benefits of fast and reliable Turbo Boost technology to give you high frequencies only when you need it most. This conserves power consumption the vast majority of time and allows Intel's partners to build fanless designs that are incredibly thin.
The 5Y10 and 5Y10a differ only in that the non-A variant has a configurable TDP down the 4.0 watts should the vendor opt for that.
Intel is also giving us a more detailed look at the Broadwell-Y PCH that includes a lot of I/O for such a small platform. Two channels of USB 3.0 can support four total ports and as many as four SATA 6G storage units can be integrated as well. These Y-SKUs look like they have 12 lanes of PCIe 2.0 available to them should a notebook vendor decide to use PCIe storage solutions (like M.2) rather than relying purely on SATA.
At least one partner has already announced a Core M product: the Lenovo ThinkPad Helix. It appears to be an amazing 11.6-in convertible tablet design. Without a doubt we'll encouter numerous other designs at the Intel Developer Forum that starts next Tuesday.
Subject: General Tech | August 14, 2014 - 03:30 PM | Ken Addison
Tagged: video, ssd, ROG Swift, ROG, podcast, ocz, nvidia, Kaveri, Intel, g-sync, FMS 2014, crossblade ranger, core m, Broadwell, asus, ARC 100, amd, A6-7400K, A10-7800, 14nm
PC Perspective Podcast #313 - 08/14/2014
Join us this week as we discuss new Kaveri APUs, ASUS ROG Swift G-Sync Monitor, Intel Core M Processors and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
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- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Allyn Malventano
Coming in 2014: Intel Core M
The era of Broadwell begins in late 2014 and based on what Intel has disclosed to us today, the processor architecture appears to be impressive in nearly every aspect. Coming off the success of the Haswell design in 2013 built on 22nm, the Broadwell-Y architecture will not only be the first to market with a new microarchitecture, but will be the flagship product on Intel’s new 14nm tri-gate process technology.
The Intel Core M processor, as Broadwell-Y has been dubbed, includes impressive technological improvements over previous low power Intel processors that result in lower power, thinner form factors, and longer battery life designs. Broadwell-Y will stretch into even lower TDPs enabling 9mm or small fanless designs that maintain current battery lifespans. A new 2nd generation FIVR with modified power delivery design allows for even thinner packaging and a wider range of dynamic frequencies than before. And of course, along with the shift comes an updated converged core design and improved graphics performance.
All of these changes are in service to what Intel claims is a re-invention of the notebook. Compared to 2010 when the company introduced the original Intel Core processor, thus redirecting Intel’s direction almost completely, Intel Core M and the Broadwell-Y changes will allow for some dramatic platform changes.
Notebook thickness will go from 26mm (~1.02 inches) down to a small as 7mm (~0.27 inches) as Intel has proven with its Llama Mountain reference platform. Reductions in total thermal dissipation of 4x while improving core performance by 2x and graphics performance by 7x are something no other company has been able to do over the same time span. And in the end, one of the most important features for the consumer, is getting double the useful battery life with a smaller (and lighter) battery required for it.
But these kinds of advancements just don’t happen by chance – ask any other semiconductor company that is either trying to keep ahead of or catch up to Intel. It takes countless engineers and endless hours to build a platform like this. Today Intel is sharing some key details on how it was able to make this jump including the move to a 14nm FinFET / tri-gate transistor technology and impressive packaging and core design changes to the Broadwell architecture.
Intel 14nm Technology Advancement
Intel consistently creates and builds the most impressive manufacturing and production processes in the world and it has helped it maintain a market leadership over rivals in the CPU space. It is also one of the key tenants that Intel hopes will help them deliver on the world of mobile including tablets and smartphones. At the 22nm node Intel was the first offer 3D transistors, what they called tri-gate and others refer to as FinFET. By focusing on power consumption rather than top level performance Intel was able to build the Haswell design (as well as Silvermont for the Atom line) with impressive performance and power scaling, allowing thinner and less power hungry designs than with previous generations. Some enthusiasts might think that Intel has done this at the expense of high performance components, and there is some truth to that. But Intel believes that by committing to this space it builds the best future for the company.
Subject: General Tech, Graphics Cards, Processors | July 2, 2014 - 03:55 AM | Scott Michaud
Tagged: Intel, Xeon Phi, xeon, silvermont, 14nm
Anandtech has just published a large editorial detailing Intel's Knights Landing. Mostly, it is stuff that we already knew from previous announcements and leaks, such as one by VR-Zone from last November (which we reported on). Officially, few details were given back then, except that it would be available as either a PCIe-based add-in board or as a socketed, bootable, x86-compatible processor based on the Silvermont architecture. Its many cores, threads, and 512 bit registers are each pretty weak, compared to Haswell, for instance, but combine to about 3 TFLOPs of double precision performance.
Not enough graphs. Could use another 256...
The best way to imagine it is running a PC with a modern, Silvermont-based Atom processor -- only with up to 288 processors listed in your Task Manager (72 actual cores with quad HyperThreading).
The main limitation of GPUs (and similar coprocessors), however, is memory bandwidth. GDDR5 is often the main bottleneck of compute performance and just about the first thing to be optimized. To compensate, Intel is packaging up-to 16GB of memory (stacked DRAM) on the chip, itself. This RAM is based on "Hybrid Memory Cube" (HMC), developed by Micron Technology, and supported by the Hybrid Memory Cube Consortium (HMCC). While the actual memory used in Knights Landing is derived from HMC, it uses a proprietary interface that is customized for Knights Landing. Its bandwidth is rated at around 500GB/s. For comparison, the NVIDIA GeForce Titan Black has 336.4GB/s of memory bandwidth.
Intel and Micron have worked together in the past. In 2006, the two companies formed "IM Flash" to produce the NAND flash for Intel and Crucial SSDs. Crucial is Micron's consumer-facing brand.
So the vision for Knights Landing seems to be the bridge between CPU-like architectures and GPU-like ones. For compute tasks, GPUs edge out CPUs by crunching through bundles of similar tasks at the same time, across many (hundreds of, thousands of) computing units. The difference with (at least socketed) Xeon Phi processors is that, unlike most GPUs, Intel does not rely upon APIs, such as OpenCL, and drivers to translate a handful of functions into bundles of GPU-specific machine language. Instead, especially if the Xeon Phi is your system's main processor, it will run standard, x86-based software. The software will just run slowly, unless it is capable of vectorizing itself and splitting across multiple threads. Obviously, OpenCL (and other APIs) would make this parallelization easy, by their host/kernel design, but it is apparently not required.
It is a cool way that Intel arrives at the same goal, based on their background. Especially when you mix-and-match Xeons and Xeon Phis on the same computer, it is a push toward heterogeneous computing -- with a lot of specialized threads backing up a handful of strong ones. I just wonder if providing a more-direct method of programming will really help developers finally adopt massively parallel coding practices.
I mean, without even considering GPU compute, how efficient is most software at splitting into even two threads? Four threads? Eight threads? Can this help drive heterogeneous development? Or will this product simply try to appeal to those who are already considering it?