Subject: General Tech, Graphics Cards, Processors | July 2, 2014 - 03:55 AM | Scott Michaud
Tagged: Intel, Xeon Phi, xeon, silvermont, 14nm
Anandtech has just published a large editorial detailing Intel's Knights Landing. Mostly, it is stuff that we already knew from previous announcements and leaks, such as one by VR-Zone from last November (which we reported on). Officially, few details were given back then, except that it would be available as either a PCIe-based add-in board or as a socketed, bootable, x86-compatible processor based on the Silvermont architecture. Its many cores, threads, and 512 bit registers are each pretty weak, compared to Haswell, for instance, but combine to about 3 TFLOPs of double precision performance.
Not enough graphs. Could use another 256...
The best way to imagine it is running a PC with a modern, Silvermont-based Atom processor -- only with up to 288 processors listed in your Task Manager (72 actual cores with quad HyperThreading).
The main limitation of GPUs (and similar coprocessors), however, is memory bandwidth. GDDR5 is often the main bottleneck of compute performance and just about the first thing to be optimized. To compensate, Intel is packaging up-to 16GB of memory (stacked DRAM) on the chip, itself. This RAM is based on "Hybrid Memory Cube" (HMC), developed by Micron Technology, and supported by the Hybrid Memory Cube Consortium (HMCC). While the actual memory used in Knights Landing is derived from HMC, it uses a proprietary interface that is customized for Knights Landing. Its bandwidth is rated at around 500GB/s. For comparison, the NVIDIA GeForce Titan Black has 336.4GB/s of memory bandwidth.
Intel and Micron have worked together in the past. In 2006, the two companies formed "IM Flash" to produce the NAND flash for Intel and Crucial SSDs. Crucial is Micron's consumer-facing brand.
So the vision for Knights Landing seems to be the bridge between CPU-like architectures and GPU-like ones. For compute tasks, GPUs edge out CPUs by crunching through bundles of similar tasks at the same time, across many (hundreds of, thousands of) computing units. The difference with (at least socketed) Xeon Phi processors is that, unlike most GPUs, Intel does not rely upon APIs, such as OpenCL, and drivers to translate a handful of functions into bundles of GPU-specific machine language. Instead, especially if the Xeon Phi is your system's main processor, it will run standard, x86-based software. The software will just run slowly, unless it is capable of vectorizing itself and splitting across multiple threads. Obviously, OpenCL (and other APIs) would make this parallelization easy, by their host/kernel design, but it is apparently not required.
It is a cool way that Intel arrives at the same goal, based on their background. Especially when you mix-and-match Xeons and Xeon Phis on the same computer, it is a push toward heterogeneous computing -- with a lot of specialized threads backing up a handful of strong ones. I just wonder if providing a more-direct method of programming will really help developers finally adopt massively parallel coding practices.
I mean, without even considering GPU compute, how efficient is most software at splitting into even two threads? Four threads? Eight threads? Can this help drive heterogeneous development? Or will this product simply try to appeal to those who are already considering it?
Subject: General Tech | April 3, 2014 - 03:19 PM | Jeremy Hellstrom
Tagged: Braswell, Bay Trail, Intel, SoC, 14nm, idf
Intel's Atom has finally shaken the bad name that its progenitors have born as Bay Trail proves to be a great implementation of an SoC. At IDF we received a tantalizing glimpse at the next generation of SoC from Intel, the 14nm Braswell chip though little was said of their ultra low powered Cherry Trail SoC for tablets. Braswell is more than just a process shrink, Intel is working to increase their support of Chromebooks and Android by creating a 64-bit Android kernel that supports Android 4.4. This seems to have paid off as Kirk Skaugen mentioned to The Inquirer that Intel chips will be present in 20 soon to be released models, up from 4 currently.
"INTEL HAS REVEALED PLANS to launch Braswell, a more powerful successor to the Bay Trail system on a chip (SoC) line used in low-cost devices like Chromebooks and budget PCs."
Here is some more Tech News from around the web:
- Intel chip revenue declined in 2013 as worldwide total grew by five percent @ The Inquirer
- TSMC capacity booked to the end of 3Q14 @ DigiTimes
- What took you so long Apple? 26 remote exec bugs die in OS X Safari @ The Register
- MSI/Informatique OC Academy featuring HWinfo Pro OC Team @ Madshrimps
Subject: General Tech | November 20, 2013 - 12:53 PM | Jeremy Hellstrom
Tagged: Xeon Phi, knights landing, Intel, 14nm
Intel has been talking up the Xeon Phi, first of the Knight's Landing chips which shall arrive in the not too distant future. This new architecture is touted to bring a return of homogeneous systems architecture which will perform parallel processing on its many cores, currently 61 is the number being tossed around, at a level of performance that will exceed the GPU accelerated heterogeneous architecture being pushed by AMD and NVIDIA. Whether this is true or not remains to be seen but many server builders may prefer the familiar CPU only architecture and as at least some of the Phi's will be available in rack mounted form and not just addin cards they may choose Intel out of habit. You can also read about Micron's Automata Processor which The Register reports can outperform a 48-chip cluster of Intel Xeon 5650s in certain scenarios.
"From Intel's point of view, today's hottest trend in high-performance computing – GPU acceleration – is just a phase, one that will be superseded by the advent of many-core CPUs, beginning with Chipzilla's next-generation Xeon Phi, codenamed "Knights Landing"."
Here is some more Tech News from around the web:
- AMD makes more profit than Sony on the PS4 @ The Inquirer
- Decades ago, computing was saved by CMOS. Today, no hero is in sight @ The Register
- Who wants 10TB of FREE cloud storage? Hands down if China is a deal breaker? @ The Register
- Benchmarking Amazon's New EC2 "C3" Instance Types @ Phoronix
- What took you 2 years? LSI finally rolls out next-gen SandForce kit @ The Register
- Beginners Guide: How To Install / Remove an Intel Socket LGA2011 CPU @ PCSTATS
- Hardware.Info UK Awards 2013: vote and win a Zotac GeForce GTX 780 AMP! Edition
Subject: Processors, Mobile | October 29, 2013 - 12:24 PM | Ryan Shrout
Tagged: techcon, Intel, arm techcon, arm, Altera, 14nm
In February of this year Intel and Altera announced that they would be partnering to build Altera FPGAs using the upcoming Intel 14nm tri-gate process technology. The deal was important for the industry as it marked one of the first times Intel has shared its process technology with another processor company. Seen as the company's most valuable asset, the decision to outsource work in the Intel fabrication facilities could have drastic ramifications for Intel's computing divisions and the industry as a whole. This seems to back up the speculation that Intel is having a hard time keeping their Fabs at anywhere near 100% utilization with only in-house designs.
Today though, news is coming out that Altera is going to be included ARM-based processing cores, specifically those based on the ARMv8 64-bit architecture. Starting in 2014 Altera's high-end Stratix 10 FPGA that uses four ARM Cortex-A53 cores will be produced by Intel fabs.
The deal may give Intel pause about its outsourcing strategy. To date the chip giant has experimented with offering its leading-edge fab processes as foundry services to a handful of chip designers, Altera being one of its largest planned customers to date.
Altera believes that by combing the ARMv8 A53 cores and Intel's 14nm tri-gate transistors they will be able to provide FPGA performance that is "two times the core performance" of current high-end 28nm options.
While this news might upset some people internally at Intel's architecture divisions, the news couldn't be better for ARM. Intel is universally recognized as being the process technology leader, generally a full process node ahead of the competition from TSMC and GlobalFoundries. I already learned yesterday that many of ARM's partners are skipping the 20nm technology from non-Intel foundries and instead are looking towards the 14/16nm FinFET transitions coming in late 2014.
ARM has been working with essentially every major foundry in the business EXCEPT Intel and many viewed Intel's chances of taking over the mobile/tablet/phone space as dependent on its process technology advantage. But if Intel continues to open up its facilities to the highest bidders, even if those customers are building ARM-based designs, then it could drastically improve the outlook for ARM's many partners.
UPDATE (7:57pm): After further talks with various parties there are a few clarifications that I wanted to make sure were added to our story. First, Altera's FPGAs are primarly focused on the markets of communication, industrial, military, etc. They are not really used as application processors and thus are not going to directly compete with Intel's processors in the phone/tablet space. It remains to be seen if Intel will open its foundries to a directly competing product but for now this announcement regarding the upcoming Stratix 10 FPGA on Intel's 14nm tri-gate is an interesting progression.
Subject: General Tech | October 16, 2013 - 01:12 PM | Jeremy Hellstrom
Tagged: Intel, delay, Broadwell, 14nm
Sad news for those hoping to see Broadwell as Brian Krzanich confirmed that the delays we first heard about in June are still true and Broadwell will not be available until some time in 2014. This slowdown of their Tick Tick strategy has been caused by the high density of defects on wafers which is driving the yields down on these chips which not only leads to less profitability but also means that supplies will be too low to go to market with. He did give The Register some positive news, Intel is working on reducing the time it takes to implement changes to chips in production and within the next year they hope to be able to make changes to a chip three months before it is slated for release without negatively effecting yeilds.
"One of the biggest tasks that Intel CEO Brian Krzanich has set himself is reconfiguring Chipzilla so that it's quicker to build and deploy new products.
So it's a pity he has had to delay the rollout of 14-nanometer Broadwell processor chips until the first quarter of next year due to problems with quality control."
Here is some more Tech News from around the web:
- Intel slumps into mud despite lobbing Internet-of-Things, etc at buyers @ The Register
- How to Code Android Applications With Security In Mind @ Linux.com
- HGST pushes out bulk storage spinner with 5 power-sipping settings @ The Register
- Samsung's Green DDR4 data centre memory can save 45 terawatts per hour @ The Inquirer
- 35,000 vBulletin Sites Have Already Been Exploited By Week Old Hole @ Slashdot
- Building a Rail Gun @ Hack a Day
- Backup4all Professional and novaPDF Professional @ Computing on Demand
Subject: General Tech | September 10, 2013 - 02:29 PM | Tim Verry
Tagged: Intel, idf 2013, idf, haswell, fanless, convertible tablet, Broadwell, 14nm
New Intel CEO Brian Krzanich took the stage at IDF 2013 to talk about Intel's future and the PC market. The CEO believes that there is more innovation in the PC than ever before as the company introduces new Haswell and Broadwell chips, new form factors are being experimented with, and Intel moves from traditional CPU to SoC type of architectures.
Two such chips that Intel showed off that are aimed at consumer PCs include a new Haswell-Y chip and the launch of a 14nm Broadwell SoC.
Haswell Y is an ultra low power variant of the Haswell processors that have been avaialble in desktops since June. This new chip is a 4.5W TDP chip that will enable fanless mobile devices such as laptops and slate tablets. The x86-64 chip will allow fanless mobiles that run Windows and should be a good bit more powerful than current Atom-powered Windows mobiles!
A fanless Haswell Y system.
In addition to Haswell Y, Intel is introducing a 14nm Broadwell SoC. The Broadwell chips will be used in both servers and consumer products in 2014.
The 14nm Broadwell SoC.
Interestingly, it looks like Intel is well on its way to shipping chips as Intel showed off a working laptop with the Broadwell chip at IDF today. Further, Intel announced that the Broadwell chips will be shipping by the end of the year!
A 14nm Broadwell-powered laptop.
Stay tuned to PC Perspective for more information!
Subject: General Tech | July 23, 2013 - 03:44 PM | Jeremy Hellstrom
Tagged: Intel, atom, 14nm, Avoton, Broadwell, Denverton, xeon, rangeley
Intel has spent the day announcing new products for the server room, from new Atoms to Xeons. Atom will bear the names of Avoton and Rangeley, Avoton will deal with microservers where power and heat are a major concern while Rangeley will appear in network devices and possibly mobile communication devices. In the case of Avoton it will be replacing a chip that has not yet been released, the 32nm Atom S1200 lineup is due out in the near future and will fill a new niche for Intel that Centerton failed to fill. The Register talks a bit more indepth here.
Slightly more powerful will be new Broadwell and Denverton Xeons, the first SoC server chips from Intel which will be manufactured on the 14nm process. We heard much less about these upcoming chips, due for 2014 but you can read what is available at The Inquirer.
"SAN FRANCISCO: CHIPMAKER Intel has revealed more details about its server processor roadmap, including its upcoming Atom chips codenamed Avoton and Rangeley and new 14nm Xeon and Atom parts codenamed Broadwell and Denverton, respectively."
Here is some more Tech News from around the web:
- Multiple Raspberry Pi boards used to create video wall @ Hack a Day
- PIN-Cracking Robot To Be Showed Off At Defcon @ Slashdot
- Flexible PCB makers gearing up mass production for new iPhones @ DigiTimes
- ARM servers to gain boost from ARM, Oracle Java partnership @ The Register
- Linksys EA6700 review: dual-core high-end ac router @ Hardware.info
- UK flicks switch on 'I am a pervert' web filters @ The Register
- Win one of Raijintek's new CPU coolers @ Kitguru
Subject: Processors | June 21, 2013 - 09:39 AM | Tim Verry
Tagged: Intel, haswell, cpu, Broadwell, 14nm
Alongside the good news of 8-core Haswell-E parts, VR-Zone revealed an updated Intel road map that makes no mention of the 14nm Haswell architecture die shrink Broadwell. Broadwell was originally intended to be the next "tick" in Intel's yearly "tick-tock" chip release schedule set to release next year. If recent reports are true, this will no longer be the case. Instead, 2014 will be dominated (at least on the Intel side of things) by consumer Haswell and enthusiast-grade Haswell-E chips.
What is going on with Broadwell?
Broadwell is essentially supposed to be a CPU using the Haswell micro-architecture that is built on a (impressively) smaller 14nm manufacturing process. There may be a few minor tweaks to the architecture or updates to the instruction set extensions, but the big difference between Broadwell and Haswell is the die shrink from 22nm to 14nm. The die shrink will allow for better low-power performance and will be beneficial in battery-powered mobile devices first and foremost. Likely as a result of the main benefits being mobile parts, Intel has previously announced that Broadwell chips would be BGA only, which means that there would not be a traditional LGA socket-ed desktop part. Broadwell chips would only come soldered onto motherboards in bare-bones systems, laptops, and tablets for example.
Despite the small architectural differences, the die shrink alone is a monumental task. Intel needs to not only be able to shrink Haswell and its wealth of transistors to 14nm, but it has to do so in a way that allows them to get the yields and power efficiency characteristics that they want. This is extremely hard, and the move to manufacturing nodes below 22nm is going to get exceedingly difficult. Intel accomplished 22nm with its Tri-gate 3D transistors, but with 14nm they are going to have to push beyond that, and even with its huge money vault, physics is working against them in a big way here. As a result of the huge challenges of moving to 14nm, it seems at this point that Broadwell will not be ready in time for a 2014 launch after all. Instead, Intel is now shooting for a 2015 launch of the BGA Broadwell chips alongside the LGA (socket-ed) 14nm Sky Lake processors (the "tock" to Broadwell's "tick").
Some enthusiasts and media have painted the Broadwell delay to be, at least in part, due to less competition from AMD. That is possible, but I can't help but thinking that slowing down Broadwell is the last thing Intel would want to do. The sooner Intel is able to move its Haswell (and future) micro-architecture-based chips to 14nm and beyond, the sooner AMD is put all that much farther behind. If Intel had managed 14nm Broadwell in 2014, AMD would have been screwed out of a lot of SFF NUC-type systems as well as mobile devices as they would not really be able to compete on performance or power efficiency! (Then Intel could happily focus on trying to bring down ARM in the mobile space, which it seems to want to do heh.) In some internal discussion with PC Perspective's Josh Walrath, I think that Intel would have loved to bring 14nm chips next year but, because of manufacturing process woes, the chips are simply not ready.
The new plan: Refresh Haswell in 2014 with a new Z97 chipset
Now, with the launch of Broadwell moved back to at least 2015, consumers will now be presented with a refresh of 22nm Haswell chips on the consumer side around Q2 2014 and the upcoming launch of enthusiast-platform Haswell-E processors in the second half of 2014.
The Haswell (LGA 1150) refresh will include better binned chips with a lineup that is likely to see a slight speed bump in stock clockspeed across the board as well as an updated Z97 chipset. The new chipset will support 1000 MB/s SATA Express and boot-level malware protection technology in the form of Intel Device Protection and Boot Guard. Granted motherboards using the updated Z97 chipset are not going to be all that alluring to those users already running Z87 chipsets with their Haswell processors. However, users that have not yet upgraded might as well go with the newer chipset and enjoy the small tweaks and benefits that go along with it. In other words, if you were holding out waiting to upgrade to a Broadwell CPU plus motherboard combo, you are going to be waiting at least another year. You will be able to grab a refreshed Haswell CPU and a Z87 or Z97 chipset-based motherboard next year though (which should still be a healthy upgrade if you have a pre-Sandy Bridge system).
Also worth noting is that if you have already upgraded to Haswell, you can rest easy knowing that you have at least another year of your chip being the newest model--quite a feat considering how fast the tech world traditionally moves!
On the other hand, if Haswell just isn't fast enough, there is always Haswell-E to look forward to in 2014! Haswell-E will bring 8-core, 16-thread chips with 20MB of L3 cache (up to ~140W TDP) and the X99 chipset, which should keep the top-end enthusiast market happy no matter the state of Broadwell.
I'm looking forward to more details regarding the 14nm manufacturing process, and hoping that once the chips are on the way the company will be willing to talk about some of the challenges and issues they faced moving to such a small process node (perhaps at IDF? One can hope.) In the mean time, Haswell has another year to shine and make Intel money while AMD works on its HSA and APU strategies.
What do you think about the 14nm Broadwell delay? Does it impact you, or were you waiting for Haswell-E anyway?
Subject: General Tech | September 21, 2012 - 01:58 PM | Jeremy Hellstrom
Tagged: 14nm, FinFET, 3d transistors, GLOBALFOUNDRIES, SoC
Intel was first out of the gate with their 3D transistors, which they dubbed Tri-gate and which the rest of the world refers to as FinFET as the normal 2D transistor is flipped on its side in a position reminiscent of a fin. This leads to much more efficient power usage, perfect for mobile designs and needed as the transistor density at 14nm is going to be quite high. GLOFO's 14nm eXtreme Mobility will work in conjunction with the current 20nm process used to fabricate SOCs and will be the basis of many lines of chips, such as ARM who have signed a multiyear contract with GLOFO. Check out DigiTimes for more.
"Globalfoundries has announced the launch of a new technology designed for the expanding mobile market. The new 14nm-XM offering will give customers the performance and power benefits of three-dimensional "FinFET" transistors with less risk and a faster time-to-market, helping the fabless ecosystem maintain its leadership in mobility while enabling a new generation of smart mobile devices, according to the foundry."
Here is some more Tech News from around the web:
- Microsoft releases VMware-EATER @ The Register
- Deep, deep dive inside Intel's next-generation processor @ The Register
- Oh, Sublime Text, how do I love thee @ The Tech Report
- NVIDIA To Publicly Release Some Documentation @ Phoronix
- Logitech C920 HD Pro Webcam Review @ NikKTech (As seen on the PCPer Podcast)
- How to repair a ribbon cable connection on consumer electronics @ Hack a Day
- Apple iOS 6 Review @ TechReviewSource
- Win AFOX HD7850 Single Slot Crossfire @ Kitguru
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