Intel Plans 7nm in 2018

Subject: Processors | February 26, 2015 - 10:27 PM |
Tagged: Intel, 14nm, 10nm, 7nm

In the PC industry, our CPUs are beginning to appear at 14nm while graphics processors have been at 28nm for a few years. Smaller features allow for more complicated circuits in the same area, which allows for less power, less heat, and more products to be created from a single wafer (assuming you can keep defects to a minimum). Intel expects to release 10nm in late 2016 (possibly slipping into early 2017) and has just announced plans for 7nm in 2018.


According to Ars Technica, this 7nm process is expected to move beyond silicon FinFETs. At room temperature, a 7nm structure of Silicon is a lattice that is approximately 14 atoms wide. Intel was quiet with the details, but Ars expects that “III-V transistors” will be the next stage -- semiconductors made from alloys of Group III and Group V metals. One example of a III-V semiconductor is Indium Gallium Arsenic. Indium and Gallium are Group III while Arsenic is Group V. Apart from using a new material for transistors, it is speculated that Intel might change the way that they package chips into a 2.5D or 3D configuration (maybe even depending on the use case).

Source: Ars Technica

ARM and TSMC are headed for 10nm

Subject: General Tech | October 6, 2014 - 12:30 PM |
Tagged: arm, TSMC, 10nm, FinFET, armv8-a

ARM and TSMC are moving ahead at an impressive pace, now predicting 10nm FinFET designs taping out possibly in the fourth quarter of 2015.  That could even be possible considering how quickly they incorporated FinFET to move from 20nm SoC to 16nm.  The  the ARMv8-A processor architecture will have a few less transistors than a high end CPU which does help their process adoption move more quickly than AMD or Intel but with AMD partnering up with ARM there is the possibility of seeing this new ARM architecture in AMD chips in the not too distant future.  As DigiTimes points out, there are many benefits that have come from this partnership between ARM and TSMC.


"ARM and Taiwan Semiconductor Manufacturing Company (TSMC) have announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10nm FinFET process technology. Because of the success in scaling from 20nm SoC to 16nm FinFET, ARM and TSMC have decided to collaborate again for 10FinFET."

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Source: DigiTimes

Big Flashy news from Samsung

Subject: General Tech | April 11, 2013 - 02:38 PM |
Tagged: tlc, Samsung, flash memory, 10nm

A process shrink to 10nm wasn't enough for Samsung, they also doubled the density of their MLC flash storage to 128Gbits at a physical size of 170.6mm2.  They claim write speeds of up to 18MB/sec and 400Mbit/s bandwidth through their toggle interface.  Even better news for consumers is that this should be even cheaper than current MLC flash which will help continue to drive the price of SSDs down.  Samsung didn't tell The Inquirer when we can expect to see these in devices but it should not be too long from now that we are doing longevity testing on this new Flash.


"MEMORY MAKER Samsung has announced that it is producing 128Gbit 3-bit multi-level cell (MLC) NAND flash chips for solid-state disk (SSD) drives"

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Source: The Inquirer