Core M 5Y70 Early Testing
During a press session today with Intel, I was able to get some early performance results on Broadwell-Y in the form of the upcoming Core M 5Y70 processor.
Testing was done on a reference design platform code named Llama Mountain and at the heart of the system is the Broadwell-Y designed dual-core CPU, the Core M 5Y70, which is due out later this year. Power consumption of this system is low enough that Intel has built it with a fanless design. As we posted last week, this processor has a base frequency of just 1.10 GHz but it can boost as high as 2.6 GHz for extra performance when it's needed.
Before we dive into the actual result, you should keep in mind a couple of things. First, we didn't have to analyze the systems to check driver revisions, etc., so we are going on Intel's word that these are setup as you would expect to see them in the real world. Next, because of the disjointed nature of test were were able to run, the comparisons in our graphs aren't as great as I would like. Still, the results for the Core M 5Y70 are here should you want to compare them to any other scores you like.
First, let's take a look at old faithful: CineBench 11.5.
UPDATE: A previous version of this graph showed the TDP for the Intel Core M 5Y70 as 15 watts, not the 4.5 watt listed here now. The reasons are complicated. Even though the Intel Ark website lists the TDP of the Core M 5Y70, Intel has publicly stated the processor will make very short "spikes" at 15 watts when in its highest Turbo Boost modes. It comes to a discussion of semantics really. The cooling capability of the tablet is only targeted to 4.5-6.0 watts and those very short 15 watt spikes can be dissipated without the need for extra heatsink surface...because they are so short. SDP anyone? END UPDATE
With a score of 2.77, the Core M 5Y70 processor puts up an impressive fight against CPUs with much higher TDP settings. For example, Intel's own Pentium G3258 gets a score of 2.71 in CB11, and did so with a considerably higher thermal envelope. The Core i3-4330 scores 38% higher than the Core M 5Y70 but it requires a TDP 3.6-times larger to do so. Both of AMD's APUs in the 45 watt envelope fail to keep up with Core M.
Subject: General Tech, Networking, Processors | September 8, 2014 - 09:29 AM | Scott Michaud
Tagged: xeon e5-2600 v3, xeon e5, Intel
So, to coincide with their E5-2600 v3 launch, Intel is discussing virtualized LANs and new, high-speed PCIe-based, networking adapters. Xeons are typically used in servers and their networking add-in boards will often shame what you see on a consumer machine. One of these boards supports up to two 40GbE connections, configurable to four 10GbE, for all the bandwidth.
The Intel XL710 is their new network controller, which I am told is being manufactured at 28nm. It is supposedly more power efficient, as well. In their example, a previous dual 10-gigabit controller will consume 5.2W of power while a single 40-gigabit will consume 3.3W. In terms of a network adapter, that is a significant reduction, which is very important in a data center due to the number of machines and the required air conditioning.
As for the virtualized networking part of the announcement, Intel is heavily promoting Software-defined networking (SDN). Intel mentioned two techniques to help increase usable bandwidth and decrease CPU utilization, which is important at 40 gigabits.
Receive Side Scaling disabled
The first is "generic segmentation offload" for VXLAN (VXLAN GSO) that allows the host of any given connection to chunk data more efficiently to send out over a virtual network.
Generic Segmentation Offload disabled
The second is TCP L4 Receive Side Scaling (RSS), which splits traffic between multiple receive queues (and can be managed by multiple CPU threads). I am not a network admin and I will not claim to know how existing platforms manage traffic at this level. Still, Intel seems to claim that this NIC and CPU platform will result in higher effective bandwidth and better multi-core CPU utilization (that I expect will lead to lower power consumption).
If it works as advertised, it could be a win for customers who buy into the Intel ecosystem.
Server and Workstation Upgrades
Today, on the eve of the Intel Developer Forum, the company is taking the wraps off its new server and workstation class high performance processors, Xeon E5-2600 v3. Known previously by the code name Haswell-EP, the release marks the entry of the latest microarchitecture from Intel to multi-socket infrastructure. Though we don't have hardware today to offer you in-house benchmarks quite yet, the details Intel shared with me last month in Oregon are simply stunning.
Starting with the E5-2600 v3 processor overview, there are more changes in this product transition than we saw in the move from Sandy Bridge-EP to Ivy Bridge-EP. First and foremost, the v3 Xeons will be available in core counts as high as 18, with HyperThreading allowing for 36 accessible threads in a single CPU socket. A new socket, LGA2011-v3 or R3, allows the Xeon platforms to run a quad-channel DDR4 memory system, very similar to the upgrade we saw with the Haswell-E Core i7-5960X processor we reviewed just last week.
The move to a Haswell-based microarchitecture also means that the Xeon line of processors is getting AVX 2.0, known also as Haswell New Instructions, allowing for 2x the FLOPS per clock per core. It also introduces some interesting changes to Turbo Mode and power delivery we'll discuss in a bit.
Maybe the most interesting architectural change to the Haswell-EP design is per core P-states, allowing each of the up to 18 cores running on a single Xeon processor to run at independent voltages and clocks. This is something that the consumer variants of Haswell do not currently support - every cores is tied to the same P-state. It turns out that when you have up to 18 cores on a single die, this ability is crucial to supporting maximum performance on a wide array of compute workloads and to maintain power efficiency. This is also the first processor to allow independent uncore frequency scaling, giving Intel the ability to improve performance with available headroom even if the CPU cores aren't the bottleneck.
Subject: General Tech, Graphics Cards | September 8, 2014 - 02:03 PM | Jeremy Hellstrom
Tagged: leak, nvidia, GM204, GTX 980, GTX 980M, GTX 970, GTX 970M
Please keep in mind that this information has been assembled via research done by WCCF Tech and Videocardz off of 3DMark entries of unreleased GPUs; we won't get the official numbers until the middle of this month. That said, rumours and guesswork about new hardware are a favourite past time of our readers so here is the information we've seen so far about the upcoming GM204 chip from NVIDIA. On the desktop side is the GeForce GTX 980 and GeForce GTX 970 which should both have 4GB of GDDR5 on a 256-bit bus with GPU clock speeds ranging from 1127 to 1190 MHz. The performance that was shown on 3DMark has the GTX 980 beating the 780 Ti and R9 290X and the GTX 970 performing similarly to the plain GTX 780 and falling behind the 290X. SLI scaling looks rather attractive with a pair of GTX 980 coming within a hair of the performance of the R9 295X2.
On the mobile side things look bleak for AMD, the GTX 980M and GTX 970M surpass the current GTX 880M which in turn benchmarks far better than AMD's M290X chip. Again the scaling in SLI systems will be impressive assuming that the leaks that you can see indepth here are accurate. It won't be too much longer before we know one way or the other so you might want to keep your finger off of the Buy Button for a short while.
Subject: Storage, Shows and Expos | September 9, 2014 - 01:51 PM | Allyn Malventano
Tagged: WDC< Western Digital, WD, idf 2014, idf, hdd, Cold, Archival, Ae
We talked about helium filled, shingled HDD's from HGST earlier today. Helium may give you reduced power demands, but at the added expensive of hermetically sealed enclosures over conventional HDD's. Shingling may give added capacity, but at the expense of being forced into specific writing methods. Now we know Western Digital's angle into archival / cold storage:
..so instead of going with higher cost newer technologies, WD is taking their consumer products and making them more robust. They are also getting rid of the conventional thinking of capacity increments and are moving to 100GB increments. The idea is that once a large company or distributor has qualified a specific HDD model on their hardware, that model will stick around for a while, but be continued at an increased capacity as platter density yields increase over time. WD has also told me that capacities may even be mixed an matched within a 20-box of drives, so long as the average capacity matches the box label. This works in the field of archival / cold storage for a few reasons:
- Archival storage systems generally do not use conventional RAID (where an entire array of matching capacity disks are spinning simultaneously). Drives are spun up and written to individually, or spun up individually to service the occasional read request. This saves power overall, and it also means the individual drives can vary in capacity with no ill effects.
- Allowing for variable capacity binning helps WD ship more usable platters/drives overall (i.e. not rejecting drives that can't meet 6TB). This should drive overall costs down.
- Increasing capacity by only a few hundred GB per drive turns into *huge* differences in cost when you scale that difference up to the number of drives you would need to handle a very large total capacity (i.e. Exabytes).
So the idea here is that WD is choosing to stick with what they do best, which they can potentially do for even cheaper than their consumer products. That said, this is really meant for enterprise use and not as a way for a home power user to save a few bucks on a half-dozen drives for their home NAS. You really need an infrastructure in place that can handle variable capacity drives seamlessly. While these drives do not employ SMR to get greater capacity, that may work out as a bonus, as writes can be performed in a way that all systems are currently compatible with (even though I suspect they will be tuned more for sequential write workloads).
Here's an illustration of this difference:
The 'old' method meant that drives on the left half of the above bell curve would have to be sold as 5TB units.
With the 'new' method, drives can be sold based on a spec closer to their actual capacity yield. For a given model, shipping capacities would increase as time goes on (top to bottom of the above graphic).
To further clarify what is meant by the term 'cold storage' - the data itself is cold, as in rarely if ever accessed:
Examples of this would be Facebook posts / images from months or years ago. That data may be rarely touched, but it needs to be accessible enough to be browsed to via the internet. The few second archival HDD spinup can handle this sort of thing, while a tape system would take far too long and would likely timeout that data request.
Subject: General Tech | September 11, 2014 - 07:38 PM | Scott Michaud
Tagged: windows 9, windows, threshold, microsoft, leaked build, leak
Update: September 12th @ 12:08pm EDT
A short video has just leaked online. The screenshots cover more, but obviously as still images. It's a good idea to check out both.
Computerbase.de (linked above in "yes") claims to have access to Windows 9 Technical Preview Build 9834. This should be close to the pre-release that is rumored to be public later this month (again, if rumors are accurate). It seems to be focused on desktop usage, as rumored, but still is uncomfortably close to Windows Store and its certification requirements.
Image Credit: Computerbase.de
There are some significant changes over previous versions, from virtual desktops to a nearly borderless window look and feel, seemingly be default (saving probably about 8-10 pixels per window in width and just as much eyesore). This makes me wonder how true borderless apps (RDIO, GitHub for Windows, and Blizzard's Battle.net Launcher are examples) will play with these new styles. One of the main glitches that I have with Windows 7 is when something kicks me out of Aero and most of the non-standard styled windows freak out in one way or another (Trillian and Firefox being the most obvious offenders).
Maybe, just maybe, we will be able to get our hands on it later this month or early next month.
Subject: General Tech, Processors, Mobile | September 12, 2014 - 10:30 AM | Scott Michaud
Tagged: apple, apple a8, SoC, iphone 6, iphone 6 plus
So one of the first benchmarks for Apple's A8 SoC has been published to Rightware, and it is not very different from its predecessor. The Apple A7 GPU of last year's iPhone 5S received a score of 20,253.80 on the Basemark X synthetic benchmark. The updated Apple A8 GPU, found on the iPhone 6, saw a 4.7% increase, to 21204.26, on the same test.
Again, this is a synthetic benchmark and not necessarily representative of real-world performance. To me, though, it wouldn't surprise me if the GPU is identical, and the increase corresponds mostly to the increase in CPU performance. That said, it still does not explain the lack of increase that we see, despite Apple's switch to TSMC's 20nm process. Perhaps it matters more in power consumption and non-gaming performance? That does not align well with their 20% faster CPU and 50% faster GPU claims...
Speaking of gaming performance, iOS 8 introduces the Metal API, which is Apple's response to Mantle, DirectX 12, and OpenGL Next Initiative. Maybe that boost will give Apple a pass for a generation? Perhaps we will see the two GPUs (A7 and A8) start to diverge in the Metal API? We shall see when more benchmarks and reviews get published.
Subject: General Tech, Systems | September 9, 2014 - 07:57 PM | Scott Michaud
Tagged: toshiba, Chromebook, chromebook 2
Somehow, I heard about Toshiba's $120, Windows 8.1 tablet but not their Chromebook 2. This ChromeOS-based laptop will have a choice between one of two 13.3-inch displays. The entry level is standard HD while the premium model is upgraded with a 1080p, IPS monitor. Prices range from $249.99 to $329.99. It is expected to be available on October 5th.
On the low end, you are looking at a browser-only device with 2GB of RAM, and Intel Celeron processor, 802.11ac, HDMI out, an HD webcam, two USB ports (one 2.0 and one 3.0), and an SD card slot. The higher-end device is the same, except with the better screen and double the RAM (4GB). At $330, that is a pretty good deal if you can live in Google Chrome day-in and day-out. Of course, this raises concerns about browser lock-in because you are buying a device with only one choice. That said, you are doing the same if you buy iOS, FirefoxOS, or Windows RT devices, so it is not a complaint about ChromeOS, specifically.
As stated, the Toshiba Chromebook 2 will be available October 5th, starting at $249.99.
ECS hosted a press event in the third week of August to unveil its new product lineup and corporate direction. The press event, named "Live, Liva, Lead, L337", lays out the important aspects of the "new ECS" and its intended market direction. They introduced the LIVA mini computer with integrated 32GB and 64GB integrated SSDs, their Z97-based product line-up, and the North America LIVA design contest.
Their naming of the event was apropos to their renewed corporate vision with the first two terms, Live and LIVA, referencing their LIVA mini-PC platform. ECS developed the name LIVA by combining the words Live and Viva (Life in Spanish), signifying the LIVA line's aim at integrating itself into your daily routine and providing the ability to live a better life. Lead signifies ECS' desire to become a market leader in the Mini-PC space with their LIVA platform as well as become a more dominant player in the PC space. The last term, L337, is a reference to their L337 Gaming line of motherboards, a clear reminder of their Z97 offerings to be unveiled.
ECS seeks to consolidate its product lines, re-focusing its energy on what it excels at - offering quality products at reasonable prices. ECS seeks to leverage its corporate partnerships and design experience to build products equivalent to competitor lines at a much reduced cost to the end user. This renewed focus on quality and the end user led to a much revised Z97 board lineup in comparison to its Z87-based offerings. Additionally, their newly introduced mini-PC line, branded LIVA, seeks to offer a cheaper all-in-one alternative to the Intel NUC and GIGABYTE BRIX systems.
Subject: General Tech, Mobile | September 10, 2014 - 01:26 PM | Scott Michaud
Tagged: asus, smartwatch, zenwatch
The ASUS ZenWatch is their "first wearable device produced in partnership with Google". It is a smart watch from the Android Wear platform. It has a curved glass display of unknown resolution, a leather strap, and a "quick-release clasp". It ships with numerous faces... because it's software and it is basically free after you pay the designer, especially with the price of storage these days. It requires a phone with Android 4.3 or later.
ASUS has customized the user interface with their ZenUI. Its main usability features either interact with your phone or track your fitness activity. It acts as a pedometer, calorie counter, heart rate monitor, and fitness goal tracker. Each of these are integrated around their ZenUI.
ASUS has not publicly announced pricing or availability. According to VR-Zone, ASUS representatives state "under $200". This is significantly less than Apple's "starting at $349".
Subject: Mobile | September 9, 2014 - 12:45 PM | Sebastian Peak
Tagged: mobile gpu, mobile cpu, mobile, iphone 6 plus, iphone 6, iphone, apple, 5.5, 4.7
Today Apple finally catches up with the current smartphone industry as they announce not just a new iPhone, but two new phones - both with much larger screens.
Image credit: Apple, Inc.
In 2007 Steve Jobs proclaimed that the just-announced iPhone was five years ahead of the competition. In many ways, he was correct - though by 2012 the market had more than caught up. In fact, Apple was behind when they announced the 4-inch iPhone 5, which managed to tick the larger-screen checkbox by simply increasing the vertical resolution by 100 pixels or so. In the area of the "phablet" the iterative refresh that followed in 2013 was hardly news, and Samsung, LG, and HTC busied themselves with larger, higher-resolution offerings that made the iPhone look tiny in comparison.
Image credit: The Verge
The new iPhone 6 features a smooth (and widely leaked) design with a thin profile and rounded corners, and the expected 4.7-inch screen. However this screen is a disappointing (and very odd) 1334x750 resolution. Contrast the Nexus 5’s 4.95-inch 1080p screen, which represents what has simply become an industry standard for smartphones in the 5-inch range.
But the bigger news here (literally) is the announcement of the iPhone 6 Plus. This 5.5-inch phone has a full 1920x1080 resolution, and there are UI tweaks to iOS 8 that are only enabled on this larger version, such as an expanded landscape keyboard and horizontal home screen. The Plus also features a better camera than its 4.7-inch sibling, with optical image stabilization (OIS) implemented along with the same new image sensor.
Speaking of the image sensor, which is “all-new” according to Apple, the next-gen 8 MP iSight camera has same 1.5(micron) pixel size as before, f/2.2 aperture. True Tone flash returns, and the new camera also boasts faster “phase detection” autofocus. The image signal processor in the A8 chip is also custom designed by Apple. Another change is video slo-mo support, with up to 240fps capture.
Image credit: The Verge
The A8 itself is a second generation 64-bit chip, with 2 billion transistors on a 20nm process. This is 13% smaller than the A7, and Apple claims a 20% faster CPU, 50% faster graphics than its predecessor. Apple is also placing emphasis on sustained performance with this new chip, showcasing graphs with maintained speed within their thermal envelope during extended use. This is accompanied by the new M8 motion coprocessor, which adds new functionality for motion applications (just in time for iOS 8).
Image credit: The Verge
The screen is ion-strengthened glass (no sapphire here) with an “improved polarizer", and photo-aligned IPS LCD technology. Whatever that is. If you're interested, Sharp previously published a paper with technical details on this technology here (PDF).
Image credit: Apple, Inc.
The phones are thin, too. The iPhone 6 is 6.9mm thick, and the 6 Plus is only slightly thicker at 7.1mm.
As far as wireless communication goes, these new iPhones feature 20 bands of LTE as well as VoLTE support, and 802.11ac Wi-Fi. And Apple users can get ready to start waving their phone wildly at checkout as NFC payments come to the iPhone via “Apple Pay”. Some 22,000 retailers will work with it (it seems to be using conventional wireless credit card infrastructure).
The battery life should be improved with both phones compared to the current iPhone 5S, and particularly so with the larger iPhone 6 Plus. Apple is claiming up to 24 hours of 3G talk time and 12 hours of LTE browsing on the 5.5-inch phone, along with a 16 day standby.
The iPhone 6 and iPhone 6 Plus will be available September 19, with the 16GB versions starting at $199 and $299 respectively with a 2-year contract. Of note, while the entry-level capacity remains at just 16GB, the next model for both phones jumps to 64GB for an additional $100 each.
Introduction and Features
EVGA continues to raise the bar with the introduction of two new power supplies in their popular SuperNOVA line, the 1000 P2 and 1200 P2. Both new power supplies are 80Plus Platinum certified and feature all modular cables, high-quality Japanese brand capacitors, a single high-power +12V rail, and a 140mm dual ball bearing cooling fan (with the ability to operate in silent, fan-less mode at low power levels). The 1000 P2 and 1200 P2 are also backed by a 10-year warranty (with registration). And last but not least, many PC PSU enthusiasts will be happy to know the new 1000 P2 and 1200 P2 are being supplied by Super Flower; the same OEM that EVGA has been using for many of their higher output, premium PSUs!
EVGA was founded in 1999 with headquarters in Brea, California. They continue to specialize in producing NVIDIA based graphics adapters and Intel based motherboards and keep expanding their PC power supply product line, which now includes seventeen models ranging from the high-end SuperNOVA 1600 G2 to the budget minded EVGA 430W power supply.
In this review we will be taking a detailed look at the EVGA SuperNOVA 1200 P2 power supply.
Here is what EVGA has to say about the new SuperNOVA P2 Gold PSUs: “Introducing the EVGA SuperNOVA 1200 P2 power supply. This power supply raises the bar with 1200W of continuous power delivery and 92% (115 VAC) / 94% (220~240 VAC) efficiency. A fully modular design reduces case clutter and 100% Japanese Capacitors ensure that only the absolute best components are used. What does that mean? The best stability, reliability, overclockability and unparalleled control. The EVGA SuperNOVA 1200 P2 is the ultimate tool to eliminate all system bottlenecks and achieve unrivaled performance."
EVGA SuperNOVA 1200 P2 PSU Key Features:
• 10-Year Warranty and unparalleled EVGA Customer Support
• 80PLUS Platinum certified, with up to 92~94% efficiency under typical loads
• Tight voltage regulation (2%), stable power with low AC ripple and noise
• Highest quality Japanese brand capacitors ensure long-term reliability
• Fully modular cables to reduce clutter and improve airflow
• Quiet dual-ball bearing fan for exceptional reliability and quiet operation
• ECO Intelligent Thermal Control allows silent, fan-less operation at low power
• NVIDIA SLI and AMD Crossfire Ready
• Intel 4th Generation CPU Ready (Haswell, C6/C7 idle modes)
• Compliance with ErP Lot 6 2013 Requirement
• Active Power Factor correction (0.99) with Universal AC input
• Heavy-duty Protections: OVP, UVP, OCP, OPP, and SCP
• MSRP for the 1000 P2 PSU : $219.99 USD (181.99 after mail-in rebate, Amazon.com)
• MSRP for the 1200 P2 PSU : $269.99 USD ($225.99 after mail-in rebate, Amazon.com)
Subject: Storage, Shows and Expos | September 9, 2014 - 11:00 AM | Allyn Malventano
Tagged: ssd, SMR, pcie, NVMe, idf 2014, idf, hgst, hdd, 10TB
It's the first day of IDF, so it's only natural that we see a bunch of non-IDF news start pouring out :). I'll kick them off with a few announcements from HGST. First item up is their new SN100 line of PCIe SSDs:
These are NVMe capable PCIe SSDs, available from 800GB to 3.2TB capacities and in (PCI-based - not SATA) 2.5" as well as half-height PCIe cards.
Next up is an expansion of their HelioSeal (Helium filled) drive line:
Through the use of Shingled Magnetic Recording (SMR), HGST can make an even bigger improvement in storage densities. This does not come completely free, as due to the way SMR writes to the disk, it is primarily meant to be a sequential write / random access read storage device. Picture roofing shingles, but for hard drives. The tracks are slightly overlapped as they are written to disk. This increases density greatly, but writting to the middle of a shingled section is not possible without potentially overwriting two shingled tracks simultaneously. Think of it as CD-RW writing, but for hard disks. This tech is primarily geared towards 'cold storage', or data that is not actively being written. Think archival data. The ability to still read that data randomly and on demand makes these drives more appealing than retrieving that same data from tape-based archival methods.
Further details on the above releases is scarce at present, but we will keep you posted on further details as they develop.
Subject: Shows and Expos | September 9, 2014 - 02:27 PM | Ryan Shrout
Tagged: Skylake, Intel, idf 2014, idf, 14nm
2015 is shaping up to be an interesting year for Intel's consumer processor product lines. We are still expected to see Broadwell make some kind of debut in a socketed form in addition to the mobile releases trickling out beginning this holiday, but it looks like we will also get our first taste of Skylake late next year.
Skylake is Intel's next microarchitecture and will be built on the same 14nm process technology currently shipping with Broadwell-Y. Intel stated that it expects to see dramatic improvements in all areas of measurement including performance, power consumption and silicon efficiency.
On stage the company demoed Skylake running the 3DMark Fire Strike benchmark though without providing any kind of performance result (obviously). That graphics demo was running on an engineering development board and platform and though it looked incredibly good from where we were sitting, we can't make any guess as to the performance quite yet.
Intel then surprised us by bringing a notebook out from behind the monitor showing Skylake up and running in a mobile form factor decoding and playing back 4K video. Once again, the demo was smooth and impressive though you expect no more from an overly rehearsed keynote.
Intel concluded that it was "excited about the health of Skylake" and that they should be in mass production in the first quarter of 2015 with samples going out to customers. Looking even further down the rabbit hole the company believes they have a "great line of sight to 10nm and beyond."
Even though details were sparse, it is good news for Intel that they would be willing to show Skylake so early and yet I can't help but worry about a potentially shorter-than-expected life span for Broadwell in the desktop space. Mobile users will find the increased emphasis on power efficiency a big win for thin and light notebooks but enthusiast are still on the look out for a new product to really drive performance up in the mainstream.
Subject: Processors, Shows and Expos | September 9, 2014 - 08:02 AM | Ryan Shrout
Tagged: idf, idf 2014, Intel, keynote, live blog
Today is the beginning of the 2014 Intel Developer Forum in San Francisco! Join me at 9am PT for the first of our live blogs of the main Intel keynote where we will learn what direction Intel is taking on many fronts!
Podcast #317 - ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!
Subject: General Tech | September 11, 2014 - 11:30 AM | Ken Addison
Tagged: podcast, video, asus, X99, X99 Deluxe, Intel, core m, xeon e5-2600 v3, idf, idf 2014, fortville, 40GigE, dell, 5k, nvidia, GM204, maxwell
PC Perspective Podcast #317 - 09/11/2014
Join us this week as we discuss our ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the Store
- RSS - Subscribe through your regular RSS reader
- MP3 - Direct download link to the MP3 file
Hosts: Josh Walrath, Allyn Malventano, and Morry Tietelman
Program length: 1:33:48
Week in Review:
News items of interest:
1:15:50 NVIDIA GM204 info is leaking
Hardware/Software Picks of the Week:
Allyn: Read our IDF news!
Subject: Storage, Shows and Expos | September 10, 2014 - 12:34 PM | Allyn Malventano
Tagged: TSV, Through Silicon Via, memory, idf 2014, idf
If you're a general computer user, you might have never heard the term "Through Silicon Via". If you geek out on photos of chip dies and wafers, and how chips are assembled and packaged, you might have heard about it. Regardless of your current knowledge of TSV, it's about to be a thing that impacts all of you in the near future.
Let's go into a bit of background first. We're going to talk about how chips are packaged. Micron has an excellent video on the process here:
The part we are going to focus on appears at 1:31 in the above video:
This is how chip dies are currently connected to the outside world. The dies are stacked (four high in the above pic) and a machine has to individually wire them to a substrate, which in turn communicates with the rest of the system. As you might imagine, things get more complex with this process as you stack more and more dies on top of each other:
16 layer die stack, pic courtesy NovaChips
...so we have these microchips with extremely small features, but to connect them we are limited to a relatively bulky process (called package-on-package). Stacking these flat planes of storage is a tricky thing to do, and one would naturally want to limit how many of those wires you need to connect. The catch is that those wires also equate to available throughput from the device (i.e. one wire per bit of a data bus). So, just how can we improve this method and increase data bus widths, throughput, etc?
Before I answer that, let me lead up to it by showing how flash memory has just taken a leap in performance. Samsung has recently made the jump to VNAND:
By stacking flash memory cells vertically within a die, Samsung was able to make many advances in flash memory, simply because they had more room within each die. Because of the complexity of the process, they also had to revert back to an older (larger) feature size. That compromise meant that the capacity of each die is similar to current 2D NAND tech, but the bonus is speed, longevity, and power reduction advantages by using this new process.
I showed you the VNAND example because it bears a striking resemblance to what is now happening in the area of die stacking and packaging. Imagine if you could stack dies by punching holes straight through them and making the connections directly through the bottom of each die. As it turns out, that's actually a thing:
Subject: General Tech, Graphics Cards | September 11, 2014 - 04:46 PM | Scott Michaud
Tagged: quad sli, quad crossfire, nvidia, amd
Psst. AMD fans. Don't tell "Team Green" but Linus decided to take four R9 290X graphics cards and configure them in Quad Crossfire formation. They did not seem to have too much difficulty setting it up, although they did have trouble with throttling and setting up Crossfire profiles. When they finally were able to test it, they got a 3D Mark Fire Strike Extreme score of 14979.
Psst. NVIDIA fans. Don't tell "Team Red" but Linus decided to take four GeForce Titan Black graphics cards and configure them in Quad SLI formation. He had a bit of a difficult time setting up the machine at first, requiring a reshuffle of the cards (how would reordering PCIe slots for identical cards do anything?) and a few driver crashes, but it worked. Eventually, they got a 3D Mark Fire Strike Extreme score of around 13,300 (give or take a couple hundred).
Subject: General Tech, Mobile | September 9, 2014 - 02:51 PM | Scott Michaud
Tagged: apple, smartwatch, ios
After Apple announced the iPhone 6, iPhone 6 Plus, and Apple Pay, they unveiled their smart watch project: the Apple Watch. Technically, they actually announced three families, the Apple Watch, the Apple Watch Sport, and the Apple Watch Edition, with a combined total of 34 different models. They will launch early next year with a base price of $349. About half of the 34 models are a few millimeters smaller, 38mm vs 42mm, although both are unisex.
The main feature is its "Digital Crown". It is basically a mouse wheel which can be clicked as a Home button. This wheel can be adjusted to zoom in, adjust meters, and so forth (like a mouse wheel). Below the "Crown" is a Contacts button which, well, brings up your contacts. It has a touchscreen with force sensors, to differentiate between touch and press. The screen also provides haptic feedback for tactile sensations, which actually interests me (in terms of what developers learning what it can do if it is accessible).
Apple Watch Sport
Each model charges with a magnetic attachment on the back, although battery life is not described. I would be surprised if it was anything less than a full, woken day, but it is possible that it will not stay awake as long as you are. We just do not know at this point. This is probably the best reason to wait for a review before purchasing, if you have any level of interest. That could easily be a deal breaker.
Apple Watch Edition
The watches are all basically the same from a technological standpoint. Every model, besides the Apple Watch Sport, has a Sapphire-protected screen (the Sport uses "Ion-X glass" which we currently know nothing about). The bands are replaceable via a button latch on the back, allowing the strap to slide off of the face. The "Watch Edition" (that name...) is created from 18-karat gold. Specifically, "Each has a watch case crafted from 18-karat gold that our metallurgists have developed to be up to twice as hard as standard gold". Yes Apple, because gold is a soft metal... but I digress.
The Apple Watch will arrive in early 2015 and will start at $349. It is currently not certified by the FCC, although I am sure that the major tech blogs will announce when that happens. It requires iPhone 5 (or later).
Subject: General Tech, Cases and Cooling, Systems, Shows and Expos | September 12, 2014 - 11:20 AM | Scott Michaud
Tagged: idf, idf 2014, nuc, Intel, SFF, small form factor
A few years ago, Intel introduced the NUC line of small form factor PCs. At this year's IDF, they have announced plans to make even smaller, and cheaper, specifications that are intended for OEMs to install Windows, Linux, Android, and Chrome OS on. This initiative is not yet named, but will consist of mostly soldered components, leaving basically just the wireless adapters user-replaceable, rather than the more user-serviceable NUC.
Image Credit: Liliputing
Being the owner of Moore's Law, they just couldn't help but fit it to some type of exponential curve. While it is with respect to generation, not time, Intel expects the new, currently unnamed form factor to halve both the volume (size) and bill of material (BOM) cost of the NUC. They then said that another generation after ("Future SFF") will halve the BOM cost again, to a quarter of the NUC.
What do our readers think? Would you be willing to give up socketed components for smaller and cheaper devices in this category or does this just become indistinguishable from mobile devices (which we already know can be cheap and packed into small spaces)?
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