Flash player not detected. Click here to install flash.
« 1 2 3 4 5 »

IDF 2014: Through Silicon Via - Connecting memory dies without wires

Subject: Storage, Shows and Expos | September 10, 2014 - 12:34 PM |
Tagged: TSV, Through Silicon Via, memory, idf 2014, idf

If you're a general computer user, you might have never heard the term "Through Silicon Via". If you geek out on photos of chip dies and wafers, and how chips are assembled and packaged, you might have heard about it. Regardless of your current knowledge of TSV, it's about to be a thing that impacts all of you in the near future.

Let's go into a bit of background first. We're going to talk about how chips are packaged. Micron has an excellent video on the process here:

The part we are going to focus on appears at 1:31 in the above video:

die wiring.png

This is how chip dies are currently connected to the outside world. The dies are stacked (four high in the above pic) and a machine has to individually wire them to a substrate, which in turn communicates with the rest of the system. As you might imagine, things get more complex with this process as you stack more and more dies on top of each other:

chip stacking.png

16 layer die stack, pic courtesy NovaChips

...so we have these microchips with extremely small features, but to connect them we are limited to a relatively bulky process (called package-on-package). Stacking these flat planes of storage is a tricky thing to do, and one would naturally want to limit how many of those wires you need to connect. The catch is that those wires also equate to available throughput from the device (i.e. one wire per bit of a data bus). So, just how can we improve this method and increase data bus widths, throughput, etc?

Before I answer that, let me lead up to it by showing how flash memory has just taken a leap in performance. Samsung has recently made the jump to VNAND:

vnand crop--.png

By stacking flash memory cells vertically within a die, Samsung was able to make many advances in flash memory, simply because they had more room within each die. Because of the complexity of the process, they also had to revert back to an older (larger) feature size. That compromise meant that the capacity of each die is similar to current 2D NAND tech, but the bonus is speed, longevity, and power reduction advantages by using this new process.

I showed you the VNAND example because it bears a striking resemblance to what is now happening in the area of die stacking and packaging. Imagine if you could stack dies by punching holes straight through them and making the connections directly through the bottom of each die. As it turns out, that's actually a thing:

tsv cross section.png

Read on for more info about TSV!

Toshiba Chromebook 2: 13-inch Full HD IPS Display

Subject: General Tech, Systems | September 9, 2014 - 07:57 PM |
Tagged: toshiba, Chromebook, chromebook 2

Somehow, I heard about Toshiba's $120, Windows 8.1 tablet but not their Chromebook 2. This ChromeOS-based laptop will have a choice between one of two 13.3-inch displays. The entry level is standard HD while the premium model is upgraded with a 1080p, IPS monitor. Prices range from $249.99 to $329.99. It is expected to be available on October 5th.

toshiba-chromebook2.jpg

On the low end, you are looking at a browser-only device with 2GB of RAM, and Intel Celeron processor, 802.11ac, HDMI out, an HD webcam, two USB ports (one 2.0 and one 3.0), and an SD card slot. The higher-end device is the same, except with the better screen and double the RAM (4GB). At $330, that is a pretty good deal if you can live in Google Chrome day-in and day-out. Of course, this raises concerns about browser lock-in because you are buying a device with only one choice. That said, you are doing the same if you buy iOS, FirefoxOS, or Windows RT devices, so it is not a complaint about ChromeOS, specifically.

As stated, the Toshiba Chromebook 2 will be available October 5th, starting at $249.99.

Source: Toshiba
Author:
Manufacturer: Intel

Core M 5Y70 Early Testing

During a press session today with Intel, I was able to get some early performance results on Broadwell-Y in the form of the upcoming Core M 5Y70 processor.

llama1.jpg

Testing was done on a reference design platform code named Llama Mountain and at the heart of the system is the Broadwell-Y designed dual-core CPU, the Core M 5Y70, which is due out later this year. Power consumption of this system is low enough that Intel has built it with a fanless design. As we posted last week, this processor has a base frequency of just 1.10 GHz but it can boost as high as 2.6 GHz for extra performance when it's needed.

Before we dive into the actual result, you should keep in mind a couple of things. First, we didn't have to analyze the systems to check driver revisions, etc., so we are going on Intel's word that these are setup as you would expect to see them in the real world. Next, because of the disjointed nature of test were were able to run, the comparisons in our graphs aren't as great as I would like. Still, the results for the Core M 5Y70 are here should you want to compare them to any other scores you like.

First, let's take a look at old faithful: CineBench 11.5.

cb11.png

UPDATE: A previous version of this graph showed the TDP for the Intel Core M 5Y70 as 15 watts, not the 4.5 watt listed here now. The reasons are complicated. Even though the Intel Ark website lists the TDP of the Core M 5Y70, Intel has publicly stated the processor will make very short "spikes" at 15 watts when in its highest Turbo Boost modes. It comes to a discussion of semantics really. The cooling capability of the tablet is only targeted to 4.5-6.0 watts and those very short 15 watt spikes can be dissipated without the need for extra heatsink surface...because they are so short. SDP anyone? END UPDATE

With a score of 2.77, the Core M 5Y70 processor puts up an impressive fight against CPUs with much higher TDP settings. For example, Intel's own Pentium G3258 gets a score of 2.71 in CB11, and did so with a considerably higher thermal envelope. The Core i3-4330 scores 38% higher than the Core M 5Y70 but it requires a TDP 3.6-times larger to do so. Both of AMD's APUs in the 45 watt envelope fail to keep up with Core M.

Continue reading our preview of Intel Core M 5Y70 Performance!!

Centaur Technology Extends Their Website Countdown...

Subject: General Tech, Processors, Mobile | September 9, 2014 - 05:38 PM |
Tagged: x86, VIA, centaur technologies

In early July, we reported on VIA's Centaur Technology division getting a new website. At the time, we anticipated that it would coincide with an announcement about Isaiah II, their rumored to be upcoming x86-based SoC (maybe even compatible with ARM, too).

Android-x86.png

Fifty-one days later, on August 31st, 2014, we came back at quarter-to-four EDT and let the website run its course, refreshing occasionally. 4 PM hit and... the counter stayed at 0 days, 0 hours, 0 minutes, and 0 seconds. Okay, I said. For about an hour, I refreshed occasionally because things could have happened on Labour Day weekend. I, then, came back late in the evening, and the day after. I next thought about it the week after, at which point the website was updated... with a timer that expires on September 30th, 2014.

Well... crap.

So by the end of the month, we may find out what Centaur is trying to announce. I am a little less confident in the breadth of the announcement, given that the company waited for the timer to lapse before correcting their mistake. I would expect that if their big announcement, like a new SoC, were to hold up the launch, the company would have known ahead of time. At the moment, it sounds like a typical website redesign which got delayed.

I will hopefully be pleasantly surprised come the end of the month.

One More Thing from Apple... the Apple Watch

Subject: General Tech, Mobile | September 9, 2014 - 02:51 PM |
Tagged: apple, smartwatch, ios

After Apple announced the iPhone 6, iPhone 6 Plus, and Apple Pay, they unveiled their smart watch project: the Apple Watch. Technically, they actually announced three families, the Apple Watch, the Apple Watch Sport, and the Apple Watch Edition, with a combined total of 34 different models. They will launch early next year with a base price of $349. About half of the 34 models are a few millimeters smaller, 38mm vs 42mm, although both are unisex.

apple-watch-regular.jpg

Apple Watch

The main feature is its "Digital Crown". It is basically a mouse wheel which can be clicked as a Home button. This wheel can be adjusted to zoom in, adjust meters, and so forth (like a mouse wheel). Below the "Crown" is a Contacts button which, well, brings up your contacts. It has a touchscreen with force sensors, to differentiate between touch and press. The screen also provides haptic feedback for tactile sensations, which actually interests me (in terms of what developers learning what it can do if it is accessible).

apple-watch-sport.jpg

Apple Watch Sport

Each model charges with a magnetic attachment on the back, although battery life is not described. I would be surprised if it was anything less than a full, woken day, but it is possible that it will not stay awake as long as you are. We just do not know at this point. This is probably the best reason to wait for a review before purchasing, if you have any level of interest. That could easily be a deal breaker.

apple-watch-edition.jpg

Apple Watch Edition

The watches are all basically the same from a technological standpoint. Every model, besides the Apple Watch Sport, has a Sapphire-protected screen (the Sport uses "Ion-X glass" which we currently know nothing about). The bands are replaceable via a button latch on the back, allowing the strap to slide off of the face. The "Watch Edition" (that name...) is created from 18-karat gold. Specifically, "Each has a watch case crafted from 18-karat gold that our metallurgists have developed to be up to twice as hard as standard gold". Yes Apple, because gold is a soft metal... but I digress.

The Apple Watch will arrive in early 2015 and will start at $349. It is currently not certified by the FCC, although I am sure that the major tech blogs will announce when that happens. It requires iPhone 5 (or later).

Source: Apple

IDF 2014: Skylake Silicon Up and Running for 2H 2015 Release

Subject: Shows and Expos | September 9, 2014 - 02:27 PM |
Tagged: Skylake, Intel, idf 2014, idf, 14nm

2015 is shaping up to be an interesting year for Intel's consumer processor product lines. We are still expected to see Broadwell make some kind of debut in a socketed form in addition to the mobile releases trickling out beginning this holiday, but it looks like we will also get our first taste of Skylake late next year.

skylake1.jpg

Skylake is Intel's next microarchitecture and will be built on the same 14nm process technology currently shipping with Broadwell-Y. Intel stated that it expects to see dramatic improvements in all areas of measurement including performance, power consumption and silicon efficiency.

On stage the company demoed Skylake running the 3DMark Fire Strike benchmark though without providing any kind of performance result (obviously). That graphics demo was running on an engineering development board and platform and though it looked incredibly good from where we were sitting, we can't make any guess as to the performance quite yet.

skylake3.jpg

Intel then surprised us by bringing a notebook out from behind the monitor showing Skylake up and running in a mobile form factor decoding and playing back 4K video. Once again, the demo was smooth and impressive though you expect no more from an overly rehearsed keynote.

skylake2.jpg

Intel concluded that it was "excited about the health of Skylake" and that they should be in mass production in the first quarter of 2015 with samples going out to customers. Looking even further down the rabbit hole the company believes they have a "great line of sight to 10nm and beyond." 

Even though details were sparse, it is good news for Intel that they would be willing to show Skylake so early and yet I can't help but worry about a potentially shorter-than-expected life span for Broadwell in the desktop space. Mobile users will find the increased emphasis on power efficiency a big win for thin and light notebooks but enthusiast are still on the look out for a new product to really drive performance up in the mainstream.

IDF 2014: Western Digital announces new Ae HDD series for archival / cold storage

Subject: Storage, Shows and Expos | September 9, 2014 - 01:51 PM |
Tagged: WDC< Western Digital, WD, idf 2014, idf, hdd, Cold, Archival, Ae

We talked about helium filled, shingled HDD's from HGST earlier today. Helium may give you reduced power demands, but at the added expensive of hermetically sealed enclosures over conventional HDD's. Shingling may give added capacity, but at the expense of being forced into specific writing methods. Now we know Western Digital's angle into archival / cold storage:

WD_AE_PRN.jpg

..so instead of going with higher cost newer technologies, WD is taking their consumer products and making them more robust. They are also getting rid of the conventional thinking of capacity increments and are moving to 100GB increments. The idea is that once a large company or distributor has qualified a specific HDD model on their hardware, that model will stick around for a while, but be continued at an increased capacity as platter density yields increase over time. WD has also told me that capacities may even be mixed an matched within a 20-box of drives, so long as the average capacity matches the box label. This works in the field of archival / cold storage for a few reasons:

  • Archival storage systems generally do not use conventional RAID (where an entire array of matching capacity disks are spinning simultaneously). Drives are spun up and written to individually, or spun up individually to service the occasional read request. This saves power overall, and it also means the individual drives can vary in capacity with no ill effects.
  • Allowing for variable capacity binning helps WD ship more usable platters/drives overall (i.e. not rejecting drives that can't meet 6TB). This should drive overall costs down.
  • Increasing capacity by only a few hundred GB per drive turns into *huge* differences in cost when you scale that difference up to the number of drives you would need to handle a very large total capacity (i.e. Exabytes).

So the idea here is that WD is choosing to stick with what they do best, which they can potentially do for even cheaper than their consumer products. That said, this is really meant for enterprise use and not as a way for a home power user to save a few bucks on a half-dozen drives for their home NAS. You really need an infrastructure in place that can handle variable capacity drives seamlessly. While these drives do not employ SMR to get greater capacity, that may work out as a bonus, as writes can be performed in a way that all systems are currently compatible with (even though I suspect they will be tuned more for sequential write workloads).

Here's an illustration of this difference:

capacity 1.png

The 'old' method meant that drives on the left half of the above bell curve would have to be sold as 5TB units.

capacity 2.png

With the 'new' method, drives can be sold based on a spec closer to their actual capacity yield. For a given model, shipping capacities would increase as time goes on (top to bottom of the above graphic).

To further clarify what is meant by the term 'cold storage' - the data itself is cold, as in rarely if ever accessed:

tiers.png

Examples of this would be Facebook posts / images from months or years ago. That data may be rarely touched, but it needs to be accessible enough to be browsed to via the internet. The few second archival HDD spinup can handle this sort of thing, while a tape system would take far too long and would likely timeout that data request.

WD's Ae press blast after the break.

The 750W Antec EDGE; pretty and powerful

Subject: Cases and Cooling | September 9, 2014 - 01:09 PM |
Tagged: modular psu, Antec EDGE, antec, 80Plus Gold, 750w

The Antec EDGE 750W PSU can provide up to 62A on its four 12V rails and with six 6+2 PCIe power connectors it is perfect for a system with multiple mid to high end GPUs.  When [H]ard|OCP cracked it open they saw a high quality Seasonic design similar to the XFX XTR 750W and a decent quality 135mm fan.  Once hooked up in the torture chamber the PSU passed every test they threw at it but in the end this PSU was awarded with a Silver Award as it did not vast outclass other 750W PSUs available for significantly less money.  It is a very good choice and if you see it on sale you should consider it a serious contender for your hard earned cash.

1409195460EH8DFZVILL_2_10_l.jpg

"Antec is easily a go-to brand for many computer hardware enthusiasts and Antec has not been resting on its reputation. Today is the debut of the Antec EDGE 750W. This PSU boasts full modularity, up to 92% efficiency, high quality Japanese capacitors, "Flat Stealth Wires," all riding on two "High Current Rails.""

Here are some more Cases & Cooling reviews from around the web:

CASES & COOLING

Source: [H]ard|OCP

Apple Announces New iPhone 6 and Larger iPhone 6 Plus

Subject: Mobile | September 9, 2014 - 12:45 PM |
Tagged: mobile gpu, mobile cpu, mobile, iphone 6 plus, iphone 6, iphone, apple, 5.5, 4.7

Today Apple finally catches up with the current smartphone industry as they announce not just a new iPhone, but two new phones - both with much larger screens.

IPHONE_6_COVER.png

Image credit: Apple, Inc.

In 2007 Steve Jobs proclaimed that the just-announced iPhone was five years ahead of the competition. In many ways, he was correct - though by 2012 the market had more than caught up. In fact, Apple was behind when they announced the 4-inch iPhone 5, which managed to tick the larger-screen checkbox by simply increasing the vertical resolution by 100 pixels or so. In the area of the "phablet" the iterative refresh that followed in 2013 was hardly news, and Samsung, LG, and HTC busied themselves with larger, higher-resolution offerings that made the iPhone look tiny in comparison.

DSC_4503.jpg

Image credit: The Verge

The new iPhone 6 features a smooth (and widely leaked) design with a thin profile and rounded corners, and the expected 4.7-inch screen. However this screen is a disappointing (and very odd) 1334x750 resolution. Contrast the Nexus 5’s 4.95-inch 1080p screen, which represents what has simply become an industry standard for smartphones in the 5-inch range.

But the bigger news here (literally) is the announcement of the iPhone 6 Plus. This 5.5-inch phone has a full 1920x1080 resolution, and there are UI tweaks to iOS 8 that are only enabled on this larger version, such as an expanded landscape keyboard and horizontal home screen. The Plus also features a better camera than its 4.7-inch sibling, with optical image stabilization (OIS) implemented along with the same new image sensor.

Speaking of the image sensor, which is “all-new” according to Apple, the next-gen 8 MP iSight camera has same 1.5(micron) pixel size as before, f/2.2 aperture. True Tone flash returns, and the new camera also boasts faster “phase detection” autofocus. The image signal processor in the A8 chip is also custom designed by Apple. Another change is video slo-mo support, with up to 240fps capture.

DSC_4561.jpg

Image credit: The Verge

The A8 itself is a second generation 64-bit chip, with 2 billion transistors on a 20nm process. This is 13% smaller than the A7, and Apple claims a 20% faster CPU, 50% faster graphics than its predecessor. Apple is also placing emphasis on sustained performance with this new chip, showcasing graphs with maintained speed within their thermal envelope during extended use. This is accompanied by the new M8 motion coprocessor, which adds new functionality for motion applications (just in time for iOS 8).

DSC_4520.jpg

Image credit: The Verge

The screen is ion-strengthened glass (no sapphire here) with an “improved polarizer", and photo-aligned IPS LCD technology. Whatever that is. If you're interested, Sharp previously published a paper with technical details on this technology here (PDF). 

IPHONE_THIN.PNG

Image credit: Apple, Inc.

The phones are thin, too. The iPhone 6 is 6.9mm thick, and the 6 Plus is only slightly thicker at 7.1mm.

As far as wireless communication goes, these new iPhones feature 20 bands of LTE as well as VoLTE support, and 802.11ac Wi-Fi. And Apple users can get ready to start waving their phone wildly at checkout as NFC payments come to the iPhone via “Apple Pay”. Some 22,000 retailers will work with it (it seems to be using conventional wireless credit card infrastructure).

The battery life should be improved with both phones compared to the current iPhone 5S, and particularly so with the larger iPhone 6 Plus. Apple is claiming up to 24 hours of 3G talk time and 12 hours of LTE browsing on the 5.5-inch phone, along with a 16 day standby.

The iPhone 6 and iPhone 6 Plus will be available September 19, with the 16GB versions starting at $199 and $299 respectively with a 2-year contract. Of note, while the entry-level capacity remains at just 16GB, the next model for both phones jumps to 64GB for an additional $100 each.

Source: The Verge

It's a roundup in your ear

Subject: General Tech | September 9, 2014 - 12:07 PM |
Tagged: audio, roundup, earbuds

For those who prefer to leave their circumaural headsets at home and travel with earbuds, sooner or later they sustain enough damage that you need to shop for a new pair.  The least expensive model that is easily available is a decent choice but for those with specific requirements there is a round up over at The Inquirer of what they feel the best earbuds currently on the market are.  From those who like to listen to audio while swimming to those who want their earbuds to look fancy or even glow in time with the music, this round up has them all.

sony-swimming-walkman-headphones-nwz-w273-540x334.JPG

"RATHER ANNOYINGLY, we find ourselves in the market for some new earphones more often than we'd probably care to admit, whether it's because we left our last pair on the bus, stood on them, put them in the wash by mistake, or because we've managed to dodge all of the above but we've had them for years, and the audio quality has declined over time, something that shouldn't really happen, but it does."

Here is some more Tech News from around the web:

Audio Corner

Source: The Inquirer

Ignore Intel and Apple; check out what's new at HP

Subject: General Tech | September 9, 2014 - 11:16 AM |
Tagged: hp, memristor, the machine

Over at The Register is a look at a completely different conference involving HP's CTO and his companies upcoming projects.  The most interesting by far is the news about memristors, the new type of memory which uses changes in local resistance to store data at a much faster pace than current technology, which has become viable as of this year and is expected to hit the market by 2016 with the technology hitting its stride by 2018.  He also sees the current software-defined fad as being exactly that, a fad, and that advances in the performance and power usage of technology will quickly eclipse it as a viable solution, also pointing out the incredibly low adoption rate amongst enterprise.  Check out the full list of his announcements here.

martinfinkmemristorhp.jpg

"Martin Fink, the company's chief technology officer, presented HP's views at an investor conference last week and analyst haus Stifel Nicolaus' Aaron Rakers noted down what he said."

Here is some more Tech News from around the web:

Tech Talk

Source: The Register

IDF 2014: HGST announces 3.2TB NVMe SSDs, shingled 10TB HDDs

Subject: Storage, Shows and Expos | September 9, 2014 - 11:00 AM |
Tagged: ssd, SMR, pcie, NVMe, idf 2014, idf, hgst, hdd, 10TB

It's the first day of IDF, so it's only natural that we see a bunch of non-IDF news start pouring out :). I'll kick them off with a few announcements from HGST. First item up is their new SN100 line of PCIe SSDs:

Ultrastar_SN100_Family_CMYK_Master.jpg

These are NVMe capable PCIe SSDs, available from 800GB to 3.2TB capacities and in (PCI-based - not SATA) 2.5" as well as half-height PCIe cards.

Next up is an expansion of their HelioSeal (Helium filled) drive line:

10TB_Market_applications_HR.jpg

Through the use of Shingled Magnetic Recording (SMR), HGST can make an even bigger improvement in storage densities. This does not come completely free, as due to the way SMR writes to the disk, it is primarily meant to be a sequential write / random access read storage device. Picture roofing shingles, but for hard drives. The tracks are slightly overlapped as they are written to disk. This increases density greatly, but writting to the middle of a shingled section is not possible without potentially overwriting two shingled tracks simultaneously. Think of it as CD-RW writing, but for hard disks. This tech is primarily geared towards 'cold storage', or data that is not actively being written. Think archival data. The ability to still read that data randomly and on demand makes these drives more appealing than retrieving that same data from tape-based archival methods.

Further details on the above releases is scarce at present, but we will keep you posted on further details as they develop.

Full press blast for the SN100 after the break.

Source: HGST

IDF 2014: Intel and Google Announce Reference Design Program, Guaranteed 2 Week AOSP Updates

Subject: Mobile | September 9, 2014 - 10:00 AM |
Tagged: tablet, reference design program, Intel, idf 2014, idf, google, aosp, Android

During today's keynote of the Intel Developer Forum, Google and Intel jointly announced a new program aimed to ease the burden of Android deployment and speed up the operating system update adoption rates that have often plagued the ecosystem.

In today's Android market, whether we are talking about x86 or ARM-based SoC designs, the process to release a point update to the operating system is quite complicated. ODMs have to build unique operating system images for each build and each individual SKU has to pass Google Media Services (GMS). This can be cumbersome and time consuming, slowing down or preventing operating system updates from ever making it to the consumer.

androidref.jpg

With the Intel Reference Design Program, the company will provide it's partners with a single binary that allows them to choose from a pre-qualified set of components or a complete bill of materials specification. Obviously this BOM will include Intel x86 processors like Bay Trail but it should help speed up the development time of new hardware platforms. Even better, OEMs and ODMs won't have to worry about dealing with the process of passing GMS certification leaving the hardware vendor to simply release the hardware to the market.

IMG_0182.JPG

But, an even bigger step forward, is Intel's commitment on the software side. Everyone knows how fragmented the Android OS market with just 20% of the hardware on the Play Store running Android KitKat. For devices built on the Reference Design Program, Intel is going to guarantee software updates within 2 weeks of AOSP (Android Open Source Project) updates. And, that update support will be given for two years after the release of the launch of the device.

AOSP-logo.jpg

This combination of hardware and software support from Intel to its hardware ODMs should help ignite some innovation and sales in the x86 Android market. There aren't any partners to announce support for this Reference Design Program but hopefully we'll hear about some before the end of IDF. It will be very interesting to see what ARM (and its partners) respond with. There are plenty of roadblocks holding back the quick uptake of x86 Android tablets but those companies would be blind to ignore the weight that Intel can shift when the want to.

Intel Developer Forum (IDF) 2014 Keynote Live Blog

Subject: Processors, Shows and Expos | September 9, 2014 - 08:02 AM |
Tagged: idf, idf 2014, Intel, keynote, live blog

Today is the beginning of the 2014 Intel Developer Forum in San Francisco!  Join me at 9am PT for the first of our live blogs of the main Intel keynote where we will learn what direction Intel is taking on many fronts!

intelicon.jpg

ASUS ZenBook UX305 Will Be Based on Core M (Broadwell)

Subject: General Tech, Systems, Mobile | September 8, 2014 - 10:49 PM |
Tagged: Intel, asus, core m, broadwell-y, Broadwell, 14nm, ultrabook

This will probably be the first of many notebooks announced that are based on Core M. These processors, which would otherwise be called Broadwell-Y, are the "flagship" CPUs to be created on Intel's 14nm, tri-gate fabrication process. The ASUS ZenBook UX305 is a 13-inch clamshell notebook with one of three displays: 1920x1200 IPS, 1920x1200 multi-touch IPS, or 3200x1800 multi-touch IPS. That is a lot of pixels to pack into such a small display.

asus-zenbook-ux305-twinhero.jpg

While the specific processor(s) are not listed, it will use Intel HD Graphics 5300 for its GPU. This is new with Broadwell, albeit their lowest tier. Then again, last generation's 5000 and 5100 were up in the 700-800 GFLOP range, which is fairly high (around medium quality settings for Battlefield 4 at 720p). Discrete graphics will not be an option. It will come with a choice between 4GB and 8GB of RAM. Customers can also choose between a 128GB SSD, or a 256GB SSD. It has a 45Wh battery.

Numerous connectivity options are available: 802.11 a, g, n, or ac; Bluetooth 4.0; three USB 3.0 ports; Micro HDMI (out); a 3.5mm headphone/mic combo jack; and a microSD card slot. It has a single, front-facing, 720p webcam.

In short, it is an Ultrabook. Pricing and availability are currently unannounced.

Source: ASUS

NVIDIA GM204 info is leaking

Subject: General Tech, Graphics Cards | September 8, 2014 - 02:03 PM |
Tagged: leak, nvidia, GM204, GTX 980, GTX 980M, GTX 970, GTX 970M

Please keep in mind that this information has been assembled via research done by WCCF Tech and Videocardz off of 3DMark entries of unreleased GPUs; we won't get the official numbers until the middle of this month.  That said, rumours and guesswork about new hardware are a favourite past time of our readers so here is the information we've seen so far about the upcoming GM204 chip from NVIDIA.  On the desktop side is the GeForce GTX 980 and GeForce GTX 970 which should both have 4GB of GDDR5 on a 256-bit bus with GPU clock speeds ranging from 1127 to 1190 MHz.  The performance that was shown on 3DMark has the GTX 980 beating the 780 Ti and R9 290X and the GTX 970 performing similarly to the plain GTX 780 and falling behind the 290X.  SLI scaling looks rather attractive with a pair of GTX 980 coming within a hair of the performance of the R9 295X2.

NVIDIA-GeForce-GTX-980-and-GeForce-GTX-970-3DMark-Firestrike-Performance-635x599.png

On the mobile side things look bleak for AMD, the GTX 980M and GTX 970M surpass the current GTX 880M which in turn benchmarks far better than AMD's M290X chip.  Again the scaling in SLI systems will be impressive assuming that the leaks that you can see indepth here are accurate.  It won't be too much longer before we know one way or the other so you might want to keep your finger off of the Buy Button for a short while.

Source: WCCF Tech

MSI's overclocked R9 285 GAMING OC

Subject: General Tech | September 8, 2014 - 11:34 AM |
Tagged: video, tonga, radeon, r9 285, gcn. gcn 1.1, freesync, factory overclocked, amd, 285

MSI's Radeon R9 285 GAMING OC does not yet show up for sale but with it's factory overclock may arrive at a slightly higher price than the MSRP of $250.  The RAM remains at the default 5.5 GHz but the GPU has been bumped up 55MHz to 973MHz out of the box and could likely be pushed higher as MSI has included the usual suspects on this card, Twin Frozr IV Advanced and Military Class 4 components.  In [H]ard|OCP's testing the card was well matched by the GTX 760, the HD 285 won more than it lost, but not always and not by much.  Compared to the HD 280 not only did the new Tonga card usually provide better performance but the additional feature the GPU supports, of which FreeSync is only one, make the HD 285 the clear winner in that contest.  Check their full review for benchmarks.

Ryan reviewed Sapphire's model here.

14093000799PAGjpZpS2_3_3_l.jpg

"AMD has launched the $249 AMD Radeon R9 285 video card. We dive into this somewhat confusing GPU. We compare it to the GeForce GTX 760 as well as an AMD Radeon R9 280. We'll discuss GCN differences in this new video card that may give it the edge with some feedback from AMD."

Here are some more Graphics Card articles from around the web:

Graphics Cards

Source: [H]ard|OCP

Intel's security on the silicon is starting to pay dividends

Subject: General Tech | September 8, 2014 - 09:52 AM |
Tagged: IBM, Intel, txt, mcafee

Intel have been diligently working on their Trusted Execution Technology to provide security on the actual silicon and with their purchaser of McAfee this technology has quickly improved over the past year.  IBM subsidiary Softlayer, who offer cloud storage, have announced that the will be implementing TXT along with the Intel Trusted Platform module to offer enhanced security on their servers.  This should make them attractive to government and law enforcement agencies which utilize clouds storage as well as businesses that need to keep their customers data secure.  They are not the first to consider TXT but are among the largest of vendors who are currently deploying servers that take advantage of the new security.  Check out more at The Register.

figure-2-component.png

"BIG BLUE IBM has announced that its Softlayer subsidiary will be the first cloud service to offer bare metal servers powered by Intel technology that provides monitoring and security down to the microchip level."

Here is some more Tech News from around the web:

Tech Talk

Source: The Register
Author:
Subject: Processors
Manufacturer: Intel

Server and Workstation Upgrades

Today, on the eve of the Intel Developer Forum, the company is taking the wraps off its new server and workstation class high performance processors, Xeon E5-2600 v3. Known previously by the code name Haswell-EP, the release marks the entry of the latest microarchitecture from Intel to multi-socket infrastructure. Though we don't have hardware today to offer you in-house benchmarks quite yet, the details Intel shared with me last month in Oregon are simply stunning.

slides01.jpg

Starting with the E5-2600 v3 processor overview, there are more changes in this product transition than we saw in the move from Sandy Bridge-EP to Ivy Bridge-EP. First and foremost, the v3 Xeons will be available in core counts as high as 18, with HyperThreading allowing for 36 accessible threads in a single CPU socket. A new socket, LGA2011-v3 or R3, allows the Xeon platforms to run a quad-channel DDR4 memory system, very similar to the upgrade we saw with the Haswell-E Core i7-5960X processor we reviewed just last week.

The move to a Haswell-based microarchitecture also means that the Xeon line of processors is getting AVX 2.0, known also as Haswell New Instructions, allowing for 2x the FLOPS per clock per core. It also introduces some interesting changes to Turbo Mode and power delivery we'll discuss in a bit.

slides02.jpg

Maybe the most interesting architectural change to the Haswell-EP design is per core P-states, allowing each of the up to 18 cores running on a single Xeon processor to run at independent voltages and clocks. This is something that the consumer variants of Haswell do not currently support - every cores is tied to the same P-state. It turns out that when you have up to 18 cores on a single die, this ability is crucial to supporting maximum performance on a wide array of compute workloads and to maintain power efficiency. This is also the first processor to allow independent uncore frequency scaling, giving Intel the ability to improve performance with available headroom even if the CPU cores aren't the bottleneck.

Continue reading our overview of the new Intel Xeon E5-2600 v3 Haswell-EP Processors!!

Intel Networking: XL710 Fortville 40 Gigabit Ethernet and VXLAN Acceleration

Subject: General Tech, Networking, Processors | September 8, 2014 - 09:29 AM |
Tagged: xeon e5-2600 v3, xeon e5, Intel

So, to coincide with their E5-2600 v3 launch, Intel is discussing virtualized LANs and new, high-speed PCIe-based, networking adapters. Xeons are typically used in servers and their networking add-in boards will often shame what you see on a consumer machine. One of these boards supports up to two 40GbE connections, configurable to four 10GbE, for all the bandwidth.

intel-40gb-nic-01.png

The Intel XL710 is their new network controller, which I am told is being manufactured at 28nm. It is supposedly more power efficient, as well. In their example, a previous dual 10-gigabit controller will consume 5.2W of power while a single 40-gigabit will consume 3.3W. In terms of a network adapter, that is a significant reduction, which is very important in a data center due to the number of machines and the required air conditioning.

As for the virtualized networking part of the announcement, Intel is heavily promoting Software-defined networking (SDN). Intel mentioned two techniques to help increase usable bandwidth and decrease CPU utilization, which is important at 40 gigabits.

intel-40gb-nic-3.jpg

Receive Side Scaling disabled

The first is "generic segmentation offload" for VXLAN (VXLAN GSO) that allows the host of any given connection to chunk data more efficiently to send out over a virtual network.

intel-40gb-nic-2.jpg

Generic Segmentation Offload disabled

The second is TCP L4 Receive Side Scaling (RSS), which splits traffic between multiple receive queues (and can be managed by multiple CPU threads). I am not a network admin and I will not claim to know how existing platforms manage traffic at this level. Still, Intel seems to claim that this NIC and CPU platform will result in higher effective bandwidth and better multi-core CPU utilization (that I expect will lead to lower power consumption).

intel-40gb-nic-4.jpg

Both enabled

If it works as advertised, it could be a win for customers who buy into the Intel ecosystem.

Source: Intel