Flash player not detected. Click here to install flash.
« 1 2 3 4 5 »

BitFenix Announces Pandora ATX Mid-Tower Enclosure

Subject: Cases and Cooling | November 23, 2015 - 10:04 AM |
Tagged: pandora atx, Mid-Tower Case, enclosure, case, bitfenix pandora, bitfenix, atx case

BitFenix has released a larger follow up to the Pandora enclosure, previously a slim Micro-ATX tower. The new full ATX sized Pandora offers the same styling and optional customizable screen as the previous version, and now offers support for up to 360 mm radiators.


“The Pandora ATX offers the same much-loved unique styling as the original Pandora - but with housing capabilities for full-sized hardware and a 360mm radiator, either in the top or the front. Conceived as a versatile base for DIY projects, it is designed to show off your hardware in a tasteful manner through its large side window. The front panel is like no other, with the wrap-around side panels covering parts of it, leaving only a sober glossy black front panel housing the programmable 2.8" ICON color display visible through it. The ICON is a story in itself, allowing you to add any logo or picture you wish, for maximum personalization.”

I was impressed with the original Pandora when I reviewed it at the end of last year, but there were certainly concessions to size (beginning with the restriction to mATX or mITX motherboards) including limited cooler and taller GPU support. This was in fact a very narrow tower previously. With the new Pandora ATX you can have the same style including an optional LCD with ICON software that allows drag-and-drop customization with your own image. And while some might think ICON is a gimmick, and it arguably is, this is still a solid-looking enclosure.


So what exactly does this new Pandora ATX support? Here’s a rundown of the specs:

  • Highlights:
    • 2.8" BitFenix ICON Display
    • One-piece PSU cover and MB tray
    • Top, Front and Bottom Dust Filters
    • 360mm Radiator Support
    • 20mm Cable Clearance
    • Graphics Card Length up to 440mm
  • Materials: Steel, ABS
  • Colors (Interior/Exterior): Black/Black
  • Supported Motherboards: ATX, Micro ATX, Mini-ITX
  • LCD: 2.8" TFT, 240 x 320 (Pandora ATX only)
  • I/O: 2x USB 3.0, 2x USB 2.0, 2x 3.5mm Audio (Line Out, Mic-in)
  • 3.5” Drive Bays: x4, x3 (Pandora ATX Core)
  • 2.5” Drive Bays: x4, 2x (Pandora ATX Core)
  • Front Cooling: 1x 140mm (Included, Pandora ATX only), Max 3x 120mm OR 2x 140mm (Not Included)
  • Rear Cooling: 1x 120mm FDB Fan (Included)
  • Top Cooling: Max 3x 120mm OR 2x 140mm (Not Included)
  • Expansion Slots: x7
  • Power Supply: ATX & EPS, up to 220mm length
  • Dimensions (WxHxD): 203 x 510 x 558 mm
  • Weight: 9.92 kg (net), 11.4 kg (gross)

It seems that the only thing we don’t know about this new enclosure is pricing and availability, which have not yet been released.

Source: BitFenix

Thermaltake would like you to "Get to the Suppressa!"

Subject: Cases and Cooling | November 27, 2015 - 03:04 PM |
Tagged: thermaltake, Suppressor F31

The Thermaltake Suppressor F31 is significantly smaller than the F51, 497x250x515mm (19.5x9.8x20.3") and so cannot fit an eATX motherboard like its bigger sibling.  On the other hand that size is much more manageable for many and is still large enough for radiators, Morry-sized heatsinks and full sized graphics cards.  The simplicity of the exterior will appeal to many as will the many removable filters over fan intakes.  As you might expect from the name, the case is designed to quiet the components running inside and did not disappoint when [H]ard|OCP tested the case.  Check out their full review if your PC components need a new home.


"Thermaltake is upping its computer case game with the new Suppressor F31 chassis. It is nice and wide at 250mm and has plenty of features. "Leading-edge sound reduction panels on all sides, expand your cooling options with removable panels for the perfect balance in silent operation and cooling performance."

Here are some more Cases & Cooling reviews from around the web:



Source: [H]ard|OCP

Giving the R9 Nano some breathing space

Subject: Graphics Cards | November 25, 2015 - 02:54 PM |
Tagged: radeon, r9 nano, mini ITX, amd, obsidian 250d, corsair

When Ryan tested out how the R9 Nano performs in tiny cases he chose the Cooler Master Elite 110, the Raijintek Metis, the Lian Li PC-Q33BL and their PC-Q30X.  The card did slow down somewhat because of a lack of airflow in the case but that was quickly remedied with a drill press and we saw vast improvements in the in-game frequencies.  [H]ard|OCP performed a similar experiment with the Cooler Master Elite 110 as well and found similar results.

They are now back at it again, this time testing in a Corsair Obsidian Series 250D Mini ITX case, which is large enough to accommodate a full sized GPU and provide improved airflow.  They tested the Nano against a GTX 980 Ti and a R9 Fury X as they cost a similar amount to the tiny little Nano.  They tested the cards at both 1440p and 4K resolutions and as you might reasonably expect the Nano fell behind, especially at 4K.  If you have a case which can fit a full sized GPU then the Nano does not make sense to purchase, however in cases in which the larger cards will not fit then the Nano's performance is unmatched.


"Our second installment covering our AMD Radeon R9 Nano in a Small Form Factor chassis is finally done. We will upgrade the case to a Corsair Obsidian Series 250D Mini ITX PC Case and compare the R9 Nano to price competitive video cards that can be installed. We game at 1440p and 4K for the ultimate small form factor experience."

Here are some more Graphics Card articles from around the web:

Graphics Cards


Source: [H]ard|OCP

Rdio Slowly Shutting Down Starting November 23rd

Subject: General Tech | November 22, 2015 - 12:35 AM |
Tagged: rdio

I say slowly shutting down because the service will remain active for a little while, letting users finish their subscriptions or use the free option. As of now, the only announced date is that Rdio will no longer renew subscriptions (or accept new paying customers) on November 23rd.


The company recently filed for bankruptcy, after trying to raise more capital and find other ways to keep the business running. Pandora will pay $75 million for the remnants of the service, although that could change if a better offer surfaces or an issue arises in bankruptcy protection. The press release states that “many members of the Rdio team will continue to shape the future of streaming music, applying our tradition of great design and innovative engineering on an even larger stage with Pandora.” It further states “Pandora is not acquiring the operating business of Rdio,” but rather just “the technology and talent.”

Rdio has not given a date that their service will end. This news is disappointing for me, because Rdio was the first music streaming service in Canada, at least that I found out about, which led me to choose it.

Source: Rdio

Lenovo and Razer Announce Partnership for New Gaming PCs

Subject: Systems | November 27, 2015 - 02:00 PM |
Tagged: y-series, razer, Lenovo, gaming pc, gaming desktop

Lenovo has partnered with Razer for co-branded Razer Edition computers, which will be special versions of Lenovo’s Y series gaming systems. Lenovo says the first device will be officially announced at CES, with a prototype on display at DreamHack Winter 2015 in Sweden.


The prototype Razer Edition desktop (featuring Skittles-inspired ground effects)

These upcoming products will clearly add some style (and color) to Lenovo's gaming computers, and while thus far only this desktop concept has been shown the Y-series from Lenovo includes gaming laptops as well, which presumably will receive the Razer treatment going forward. It is notable that the concept incorporates multiple colors with its lighting effects (which should be customizable) considering Razer is known for a black and green color scheme.

"PC gaming today offers a rich and immersive experience – thanks in part to cutting-edge graphics performance, superior processing power, and peripherals designed specifically for gaming. Lenovo will employ its system design and engineering expertise, while Razer will enhance the immersive experience for gamers. All forthcoming Lenovo Razer Edition products will be co-branded and reflect the edgy Lenovo Y series look and feel with iconic Razer elements like customizable Chroma lighting effects."


The details as far as specs and configuration options for the desktop shown are not known, and this seems to be primarily a new branding/style for the Y-series line. More might be known after DreamHack, the event which calls itself "the world's largest digital festival", which runs November 26 - 29 in Jönköping, in the south of Sweden.

Source: Lenovo

Raspberry Pi Zero Released for $5

Subject: Systems | November 26, 2015 - 04:51 PM |
Tagged: Raspberry Pi, raspberry pi zero

The Raspberry Pi Zero is a new version that lowers the cost of gigahertz-class computing devices to just $5. It is based on a 1.0 GHz ARM11 core from Broadcom that is about 40% faster than the original Raspberry Pi. It also has 512MB of RAM, which is a lot for embedded or hobbyist applications. In fact, it doubles the original Raspberry Pi Model A (and is on part with the Model B). Storage is handled by a microSD card slot, as is the case with every previous Raspberry Pi except the Compute Module.


They also offer an alternative to the $5 price tag. If you pick up the print edition of MagPi magazine #40, which is the Christmas 2015 issue, you will receive a free Raspberry Pi Zero. The Raspberry Pi Foundation says that they printed 10,000 copies of this magazine. This is probably much more interesting than a CD-ROM demo of Battlezone II.

Due to high demand, I'm not sure when you can expect to get one though.

Source: Raspberry Pi

Samsung Announces Mass Production of 128GB DDR4 Sticks

Subject: Memory | November 26, 2015 - 05:23 PM |
Tagged: TSV, Samsung, enterprise, ddr4

You may remember Allyn's article about TSV memory back from IDF 2014. Through this process, Samsung and others are able to stack dies of memory onto a single package, which can increase density and bandwidth. This is done by punching holes through the dies and connecting them down to the PCB. The first analogy that comes to mind is an elevator shaft, but I'm not sure how accurate that is.


Anyway, Samsung has been applying it to enterprise-class DDR4 memory, which leads to impressive capacities. 64GB sticks, individual sticks, were introduced in 2014. This year, that capacity doubles to 128GB. The chips are fabricated at 20nm and each contain 8Gb (1GB) per layer. Each stick contains 36 packages of four chips.

At the end of their press release, Samsung also mentioned that they intend to expand their TSV technology into “HBM and consumer products.”

Source: Samsung